SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Akrometrix


Akrometrix LLC to Demonstrate 2D/3D Interface Analysis Software at APEX

Jan 21, 2015

Shape matching at peak reflow temperature.

Shape matching at peak reflow temperature.

Akrometrix LLC, the leader in elevated temperature surface characterization, will exhibit in Booth #2935 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will demonstrate the Interface Analysis software that allows high level and in-depth review of the attachment interface between two surfaces that warp during a microelectronics production reflow profile.

Surface-mount components may warp during the reflow process, as well as the associated land area. This warpage between components and the land area can contribute to defects such as Head-on-Pillow, shorts and opens. Fully understanding the critical interface between surfaces is more important than ever.

The Akrometrix Interface Analysis software enables 3D, 2D and statistical review of the complete interface at each temperature point during reflow and for the combined data set. Data to be analyzed can be collected with any of the 200+ TherMoiré systems in use throughout the worldwide electronics supply chain today. Introducing unique features such as Pass/Warning/Fail maps, and graphical results identifying problem areas based on user inputs, Interface Analysis allows users to see what is happening between two dynamic surfaces throughout the entire reflow process.

For more information, meet company representatives in Booth #2935 at the IPC APEX EXPO or visit www.akrometrix.com.


Akrometrix LLC, the leader in elevated temperature surface characterization, was founded in 1993 by Dr. Charles Ume, a Professor and Director of the Advanced Electronic Packaging and Laser Processing Laboratory, at the George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia.  Headquartered in Atlanta, Akrometrix supports over 250 equipment installations worldwide.  For more information, contact Akrometrix at info@akrometrix.com.

You must be a registered user to talk back to us.

More News from Akrometrix

Oct 04, 2016 -

Akrometrix Announces Next-Generation AXP Shadow Moiré System

Sep 23, 2016 -

Understanding PCB Design & Material Warpage Challenges – Learn More at SMTAI

Sep 22, 2016 -

Akrometrix Announces New Schedule for Technical Presentations

May 05, 2016 -

Akrometrix Announces the Release of the CRE6, Convection Reflow Emulation for Warpage Metrology

Apr 29, 2016 -

Akrometrix Announces the Shipment of Its 300th Shadow Moiré System

Mar 30, 2016 -

Akrometrix Announces Enhanced Digital Image Correlation (DIC) Module

Feb 25, 2016 -

Akrometrix Announces Automated Die Attach Tilt Metrology

Feb 23, 2016 -

Thermal Warpage and Strain Metrology Platforms will be Displayed at GOMACTech

Feb 18, 2016 -

PAC Global to Discuss Thermal Warpage and Strain Metrology Solutions from Akrometrix at Upcoming SMTA Expos

Feb 17, 2016 -

Akrometrix LLC Will Discuss Thermal Warpage and Strain Metrology at APEX

(9) more news from Akrometrix

Akrometrix LLC to Demonstrate 2D/3D Interface Analysis Software at APEX news release has been viewed 407 times

reflow oven profiler

Solder Paste Inspection