SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • FCT Assembly to Present Its New Process for Evaluating Solder Pastes at APEX

FCT Assembly to Present Its New Process for Evaluating Solder Pastes at APEX

Jan 19, 2015

Field application engineer, Tony Lentz.

Field application engineer, Tony Lentz.

FCT Assembly today announced that it will present a new process for evaluating solder pastes in Booth #713 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Field application engineer, Tony Lentz, also will present the paper written on the new evaulation process titled “Dispelling the Black Magic of Solder Paste.” The presentation will be held during the Fluxes Technical Conference Session on Tuesday, Feb. 24 from 1:30-3 p.m.

Lentz will present a process for evaluating solder pastes using a variety of methods. These methods are quick to run and challenging, revealing the strengths and weaknesses of solder pastes. Methods detailed in this paper include:  print volume, stencil life, response to pause, open time, tack force over time, wetting, solder balling, graping, voiding, accelerated aging and others. Hard data is gathered and used in the evaluation process. Also, Lentz will present a set of methods that do not require expensive equipment or materials, but still generate useful data. The goal is to help the electronics assembler choose the best solder paste for their process. 

Lentz has been in the electronics industry since 1994, and worked as a process engineer at a circuit board manufacturer for five years. He has extensive experience performing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards. Additionally, Lentz has been involved with APEX for many years. He holds B.S. and M.B.S. degrees in chemistry.

FCT’s experts offer technical support for solder paste, SMT stencils, reflow profiling, root cause analysis and many other phases during the SMT process. In addition to its line of solder paste, FCT manufactures other products that reduce defects and increase yields during the printing process including laser cut stencils and stencil coatings. Visit the FCT team at the IPC APEX EXPO or go to www.fctassembly.com to find out why FCT has the best performing products on the market.


FCT Assembly consists of three divisions: FCT Solder, Fine Line Stencil and A-Laser. With numerous facilities in the United States, FCT is one of the electronics industry’s leading manufacturers of lead-free and leaded solder products, superior quality stencils and precision cut parts.

The company sets itself apart from its competitors by continuously studying new products and processes in order to uphold its reputation as a leader in technology. FCT’s customers can always count on the company to use the latest technology and to supply products with the highest quality.For more information, visit www.fctassembly.com.

Mar 30, 2016 -

FCT Develops Versatile Water Soluble Flux for Leaded and Lead-Free Soldering

Mar 29, 2016 -

FCT Develops Versatile Water Soluble Flux for Leaded and Lead-Free Soldering

Feb 25, 2016 -

FCT to Showcase Advanced Printing Technologies at APEX 2016

Feb 24, 2016 -

Licensed Stencil Manufacturers Feature Florida CirTech’s NanoSlic Coating

Dec 04, 2015 -

Fine Line Stencil Upgrades Step Stencil Technology

Nov 17, 2015 -

FCT Assembly’s NanoSlic® Stencil Coating Recognized for its Electronics Assembly Innovation

Sep 01, 2015 -

FCT Assembly to Showcase Comprehensive Product Line and have Major Presence at SMTA International

Aug 04, 2015 -

A-Laser Helps Cardica Produce Next-Generation Medical Devices

Jun 08, 2015 -

A-Laser Expands Facility, Announces Appointment of New Operations Manager

Jun 08, 2015 -

FCT and Fine-Line Stencil Expand Market Presence with New Facility in Guadalajara, Mexico

165 more news from FCT ASSEMBLY, INC. »

Aug 19, 2017 -

See Latest Dispense Technology Demonstrations From GPD Global at NEPCON 2017

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

Aug 17, 2017 -

Libra Industries Announces Two 20-Year Service Awards in Q2 2017

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 -

What is SMT and where to by SMT spare parts

Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

See electronics manufacturing industry news »

FCT Assembly to Present Its New Process for Evaluating Solder Pastes at APEX news release has been viewed 513 times

  • SMTnet
  • »
  • Industry News
  • »
  • FCT Assembly to Present Its New Process for Evaluating Solder Pastes at APEX
StikNPeel™ Rework Stencils

reflow oven profiler