SMT, PCB Electronics Industry News

IWLPC Best Papers Announced

Jan 15, 2015

SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.

Boyd Rogers, Deca Technologies, won the overall Best Paper as well the Best of the WLP Track designations for his paper titled “Enhancing WLCSP Reliability Through Build-Up Structure Improvements and New Solder Alloys.” Co-authors on the paper include M. Melgo, M. Almonte, S. Jayaraman, C. Scanlan, and T. Olson.

The Best of Conference Presentation went to Sumant Sood, KLA-Tencor, for his presentation titled “High Throughput Wafer Edge Inspection and Monitoring for Advanced Wafer Level Packaging.” Co-authors of the paper include Rohit Bhat, Heiko Eisenbach, Marc Filzen, Prashant Aji, Youxian Wen (KLA Tencor); Thomas Uhrmann, Julian Bravin, and Jürgen Burggraf (EV Group.)

The Best Paper from the 3D Track was awarded to Guilian Gao, Invensas Corporation, for her paper titled “Addressing Critical Assembly Challenges In 2.5D and 3D IC Assembly.” Co-authors on the paper include Scott McGrath, Bong-Sub Lee, Cyprian Uzoh, Grant Villavicencio, Hala Shaba, Liang Frank Wang, Sitaram Arkalgud, and Eric Tosaya.

The Best of the MEMS Track went to Cihan Yilmaz, Northeastern University, for his paper titled “A New Manufacturing Approach for Fabricating Next Generation 3-D Interconnects for MEMS and ICs Using Directed Nanoparticle Assembly.” The paper’s co-authors include Adnan Korkmaz, Steven Varni, and Ahmed Busnaina (Northeastern University); and Dongguang Wei (Carl Zeiss.)

Over fifty papers, including the Best Papers, are available in the IWLCP 2014 Proceedings on USB Flash Drive from the SMTA BookStore. http://www.smta.org/stor /book_detail.cfm?book_id=446

This event continues to grow every year as wafer-level packaging gains traction in the semiconductor industry. The overall attendance of 720 technologists from 19 countries in 2014 indicated growth of nearly 26% compared to the 2013 event.

IWLPC will return to the DoubleTree Hotel in San Jose, California next October 13-15, 2015. Save the Date!

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Jun 20, 2017 -

SMTA Launches New Partnership with Thayer School of Engineering at Dartmouth College

Jun 08, 2017 -

SMTA International Conference Program Finalized and Registration Now Open

May 30, 2017 -

SMTA and CALCE Seeking Abstracts for 3rd Annual LED Assembly, Reliability, and Test Symposium

May 23, 2017 -

SMTA, iNEMI, MEPTEC Seek Presenters for 2018 Medical Electronics Symposium

May 15, 2017 -

SMTA China Presents Seven Best Paper/Best Presentation Awards and Two Best Exhibit Awards at SMTA China East Conference 2017/NEPCON China 2017

Apr 26, 2017 -

SMTA/CALCE Announce Program for Symposium on Counterfeit Parts and Materials

Apr 11, 2017 -

IBM and Siemens Experts to Keynote Contamination, Cleaning and Coating Conference

Apr 07, 2017 -

The SMTA Capital Chapter to Host a Meeting April 25th at ZESTRON Americas

Mar 15, 2017 -

Contamination, Cleaning and Coating Conference Program Finalized

Feb 05, 2017 -

SMTA Announces 2017 Educational Programming

547 more news from Surface Mount Technology Association (SMTA) »

Jun 25, 2017 -

Ersa Brings the ‘Little Big One’ to SMTA Ohio – Award-Winning Selective Solder

Jun 25, 2017 -

Optimal Electronics Releases Process Control and Traceability Solution for Nordson ASYMTEK Applications in Clean Rooms for Sensor Assembly

Jun 25, 2017 -

Inovaxe Partners with Repstronics in Mexico

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

Jun 22, 2017 -

Addressing The Modulation of Light Output -- High Quality LED Manufacturing

Jun 22, 2017 -

Schleuniger, Inc. Receives 2017 Best of Manchester Award

Jun 21, 2017 -

Inovar Inc. Breaks Ground for New Facility on USU Innovation Campus

Jun 21, 2017 -

PNC Inc. Launches Design Webinar Series

Jun 21, 2017 -

Saelig Introduces Mercury™ T2C USB 2.0 & Power Delivery Protocol Analyzer With Type-C Connection

Jun 20, 2017 -

Europlacer Secures Fourth Award from Industry Analysts Frost & Sullivan.

See electronics manufacturing industry news »

IWLPC Best Papers Announced news release has been viewed 855 times

pcb components vacuum pick up

Lead Free Wave Solder - 1 Click SMT