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TE-LOH Michael Korn KG Invests in Essemtec Equipment

Jan 14, 2015

Our new Paraquda placement machine enables precise and process-optimized work and fits in well with our usual high quality standards. In addition, it is characterized by its flexibility of component parts and PCB formats, as well as the ease of programming and the reliability of the assembly from batch size 1,

Our new Paraquda placement machine enables precise and process-optimized work and fits in well with our usual high quality standards. In addition, it is characterized by its flexibility of component parts and PCB formats, as well as the ease of programming and the reliability of the assembly from batch size 1," explains Michael Korn, owner of TE-LOH.

The North German electronics manufacturer TE-LOH Michael Korn KG is expanding its production line with a SMD assembler and a reflow oven from Essemtec.

In September 2014, the EMS service provider TE-LOH Michael Korn KG invested in the expansion of its production line. After an intense search for a flexible assembly system for the production, the electronics manufacturer decided on a pick-and-place system from Essemtec. "Our new Paraquda placement machine enables precise and process-optimized work and fits in well with our usual high quality standards. In addition, it is characterized by its flexibility of component parts and PCB formats, as well as the ease of programming and the reliability of the assembly from batch size 1," explains Michael Korn, owner of TE-LOH.

A further relevant criterion to choose the Essemtec brand was the software interface ePlace. The programming is done via a direct, universal import of CAD data. The programming effort is reduced to a minimum due to the included, comprehensive component library. Optionally, the Paraquda is available with dispensing and jet-dispensing valves for solder paste and/or adhesive applications. The integration of various systems directly into an automatic pick-and-place machine allows all the requirements for a flexible production of prototypes. It enables the possibility of stencil-free production and deliveries of boards on the day of the order intake.

For the soldering process, the company decided to purchase a RO400FC, full-convection reflow oven for small to medium volumes from Essemtec. It is characterized by its compactness and very good temperature profile control. Because of the extremely large air volume, the RO400FC is also suitable for lead-free soldering processes.

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