SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from YINCAE Advanced Materials, LLC.

YINCAE President, Dr. Wusheng Yin, Discusses Solder Joint Encapsulant & POP Assembly Solutions

Jan 12, 2015

(Albany, NY) January 12, 2015.  YINCAE Advanced Materials LLC, is now published in the Global SMT & Packaging Magazine for January 2015 titled, Solder Joint Encapsulant Adhesive-POP Assembly Solution.  This article explains extensively about solder joint encapsulant adhesives in comparison to traditional solder paste and the positive outcomes that YINCAE encapsulants can provide.
   Global SMT & Packaging is the global assembly journal for SMT and advanced packaging professionals.  They are also the #1 magazine dedicated to the global electronics manufacturing and assembly industry.
   From the publication, it is easy to find material that intends to make the manufacturing process as simple as possible with the using solder joint encapsulant adhesives. YINCAE’s SMT256 and SMT266 both eliminate the use of underfill materials and the underfilling process.  This is a great solution for POP assembly.  Based on test results, the use of SMT 256 under air reflow the void percentage of the solder joint was reduced to 2.5 percent.  The use of SMT 256 was used for under air reflow and was in comparison of 5% to using tacky flux under the reflow of nitrogen. 
   YINCAE’s solder joint encapsulant is a total assembly solution for the advanced POP, especially with TMV. Not only does it increase solder joint strength by 5 times, but it also provides excellent reliability for advanced IC components.  Using solder joint encapsulant for POP assembly proves to provide benefits such as the elimination of head-in-pillow issues, preventing dendrite formation, eliminating the difficult underfilling process, particularly for POP with TMV, easy rework, and enhanced reliability.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.  
                                           * * * * * * * * * *  

YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization. 
The YINCAE brand name and logo are registered trademarks of YINCAE Advanced Materials, LLC.

You must be a registered user to talk back to us.

More News from YINCAE Advanced Materials, LLC.

Aug 24, 2016 -


Jul 26, 2016 -


Jun 22, 2016 -

SEMICON WEST 2016 is 2 Weeks Away, Visit YINCAE Booth 6448

May 18, 2016 -

YINCAE at ECTC in Las Vegas in 2 weeks!!

Apr 27, 2016 -

ECTC is 1 Month Away Visit YINCAE Booth 506

Apr 25, 2016 -

YINCAE Advanced Materials at IMAPS NE Booth # 101

Apr 08, 2016 -

IMAPS New England 2016

Feb 09, 2016 -

IPC APEX 2016 is 1 month away!

Jan 18, 2016 -

IPC APEX 2016 is 2 months away!

Nov 18, 2015 -

YINCAE Advanced Materials Wins Global Technology Award at Productronica for World’s First Solder Joint Encapsulant

(9) more news from YINCAE Advanced Materials, LLC.

YINCAE President, Dr. Wusheng Yin, Discusses Solder Joint Encapsulant & POP Assembly Solutions news release has been viewed 420 times

Metcal soldering rework

reflow oven profiler