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CyberOptics Brings Superior Accuracy 3D SPI and High-Quality Pre-Reflow Inspection to NEPCON Japan

Jan 06, 2015

QX150i™ AOI system .

QX150i™ AOI system .

CyberOptics® Corporation (NASDAQ: CYBE) announces that it will exhibit its latest lineup of SPI and AOI systems at its representative TOYO Corporation’s booth #E6-002 at NEPCON Japan, scheduled to take place January 14-16, 2015 at the Tokyo Big Sight in Japan.

The SE600™ 3D SPI system delivers ‘true’ volume measurement and world-class usability. Designed with a state-of-the-art dual illumination sensor, it offers the best repeatability and reproducibility – even on the smallest paste deposits. The award-winning SPIv5 series software offers full touch screen capability and world-class user experience for easy, flawless inspection.

The QX150i™ AOI system offers high value, flexible inspection for all applications and is ideally suited for pre-reflow and selective solder inspection. With higher sensor resolution (12µm) and enhanced illumination, QX150i™ offers crisp images for accurate inspection with lowest false call rates. Also, the system is designed to provide easy wedge-in replacement of existing conveyors. 

The QX100™ redefines tabletop inspection by combining the performance of an in-line inspection system with the flexibility of a tabletop system. The system features CyberOptics’ unique image acquisition technology, the Strobed Inspection Module (SIM), and is capable of inspecting component sizes down to 01005.

All CyberOptics’ AOI systems are powered by AI2 (Autonomous Image Interpretation), giving you the power to inspect ‘ANYTHING’ without having to anticipate defects or predefine variance. AI2 offers precise discrimination even with excessive variance and delivers accurate results with just one example. All this means lowest false calls, zero escapes and minimal tuning. 


Founded in 1984, CyberOptics Corporation is a leading provider of sensors and inspection systems that provide process yield and throughput improvement solutions for the global electronics assembly and semiconductor capital equipment markets. The Company’s products are deployed on production lines that manufacture surface mount technology circuit boards and semiconductor process equipment. Through internal development and acquisitions, CyberOptics is strategically repositioning itself to become a global leader in high-precision 3D sensors. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through facilities in North America, Asia and Europe.

Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required for meeting customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; product introductions and pricing by our competitors; the level of revenue and loss we record in 2014; the success of our 3D technology initiatives; expectations regarding LDI and its impact on our operations; integration risks associated with LDI and other factors set forth in the Company’s filings with the Securities and Exchange Commission.

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