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A-Laser to Highlight New Capability for the MID Market at the BIOMEDevice Show

Nov 25, 2014

Molded interconnect device (MID)

Molded interconnect device (MID)

FCT Assembly announces that the A-Laser Division will discuss its new laser direct structuring (LDS) capability in Booth #235 at the BIOMEDevice Show, scheduled to take place December 3-4, 2014 at the San Jose Convention Center in California. The introduction of laser direct structuring (LDS) has revolutionized the molded interconnect device (MID) market, bringing flexibility to design and enhancing product capability.

When manufacturing LDS 3-D circuits, there are often three components to the development process. Prototypes are developed with LPKF’s proprietary proto-paint process in combination with a raw part from virtually any plastic. Next, the manufacturing industry has seen a number of innovations in the realm of 3-D printed parts through advancements in materials and printing technology. Due to the quick-turn nature of this process; cycle times can be greatly reduced in the development phase. Lastly, mold injected parts, from LDS grade materials, can be brought to full-scale production.

From prototypes to production, A-Laser guides customers through the entire project. The engineering department excels in design, while also keeping in mind process implementation and cost reduction goals. Further, LPKF has created a design guide (http://a-laser.com/assets/LDS-MID_DesignGuide.pdf) allowing optimization opportunities from the onset. For more information about A-Laser’s LDS capability, visit http://a-laser.com/3dcircuits.html. For more information about A-Laser’s advanced technology, visit www.a-laser.com.


A-Laser is a premier precision parts manufacturer, providing consistent, high quality laser services for a wide range of industries. Specializing in the processing of ultra-thin materials, our technicians provide solutions for your most challenging applications. For more information, visit www.a-laser.c

Feb 04, 2015 -

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A-Laser Announces Speakers for MID Tech Day

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A-Laser to Host Technical Event in California

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A-Laser Releases New LDS Capability for Manufacturing 3D Circuitry

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