Cranston, Rhode Island - Technic Inc. has announced the release of Techni IM Gold AT8000, a non-cyanide immersion gold that improves solderability while reducing gold usage when compared to typical cyanide based ENIG chemistry. Besides the elimination of cyanide, Techni IM Gold AT8000 slows down and controls the deposition of gold on electroless nickel. The result of a slower, more controlled reaction is the elimination of corrosion products and the creation of a pore free ENIG deposit with dramatically improved solder spread.
The controlled deposition of the Techni IM Gold AT8000 chemistry also provides more uniform plating thickness across different pad sizes. Substantial gold savings are possible due to the combination of tighter thickness distribution and thinner gold deposits.