SMT, PCB Electronics Industry News

Pan Pacific Microelectronics Symposium Program Finalized

Nov 03, 2014

SMTA announced that the program is finalized for the 20th Annual Pan Pacific Microelectronics Symposium.  The event will take place February 2-5, 2015 at the Sheraton Kauai Resort on Kauai, Hawaii.  The Pan Pacific promotes international technical interchange and provides a premier forum for extensive networking among industry professionals and business leaders throughout the world.

The technical sessions, with over 50 presentations, will include Power Electronics, Electronic Process, Emerging Technologies, Process Materials, Electronic Packaging, Failure Analysis and Reliability, Interconnect, Nano Electronic Packaging, and 2.5/3D Interposers.

On the afternoon of Monday, February 2, three keynotes will kick off the event:

Yasumitsu Orii, IBM Corporation will present "Perspective on Required Packaging Technologies for Cognitive Computing Devices;" followed by Kim Il Ung, SK CNC presenting "Memory Markets and Applications: Future Outlook;" and Shen Li Fu, Ph.D., I-Shou University will close the day with "Trends of 3D IC/3D Packaging for Mobile & Wearable Electronics." Additional keynote speakers include Horatio Quinones, Ph.D., FDCS LLC, who will present "In-situ Control Systems in Manufacturing" and Klaus-Dieter Lang, Ph.D., Fraunhofer IZM presenting "Advanced Integration Technologies for Cyber Physical Systems." On Wednesday, John Quackenbush, Dana-Farber Cancer Institute and Harvard School of Public Health, will present "The Coming of Big Data in Health Care and Biomedical Research." Dongkai Shangguan, Ph.D., NCAP China, will keynote Thursday afternoon with his presentation "3D Packaging and System Integration." Kim Gu Sung, EP Works, Kangnam University, will make the final keynote presentation, “Low Cost Through Silicon Via (TSV) Technologies.”

View the complete program and register at the website:  Please contact JoAnn Stromberg, or 952-920-7682, with questions about the program. Promotional packages are available for companies wishing to have exposure for their products and services. Contact Erin Murray,, for details.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Sep 18, 2017 -

LED A.R.T. Symposium Program Announced

Sep 06, 2017 -

Women’s Leadership Program at SMTA International

Sep 03, 2017 -

SMART Group to Become SMTA Europe

Aug 29, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Workshops

Aug 26, 2017 -

Electronics in Harsh Environments Conference Announced

Aug 16, 2017 -

SMTA Capital Expo to Feature Essemtec Fox Pick and Place System

Aug 14, 2017 -

Shannan O’Shaughnessy, GVD Corporation, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24

Aug 08, 2017 -

iNEMI’s Bill Bader to Keynote Technical Innovations Symposium at SMTA International

Aug 06, 2017 -

Gerry Partida, Summit Interconnect, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24th

Aug 01, 2017 -

Mike Bixenman, KYZEN Corporation, Wins Best of Presentation Award at the 2017 International Conference on Soldering and Reliability (ICSR)

565 more news from Surface Mount Technology Association (SMTA) »

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -


Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

Sep 19, 2017 -

BTU Introduces Profile Guardian Redundant Process Monitor during SMTAI

See electronics manufacturing industry news »

Pan Pacific Microelectronics Symposium Program Finalized news release has been viewed 1248 times

Facility Closure

IPC Training & Certification - Blackfox