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Indium Corporation Technology Experts Give Keynote, Presentation at Electronics Packaging Symposium

Oct 29, 2014

Dr. Ning-Cheng Lee, vice president of technology at Indium Corporation.

Dr. Ning-Cheng Lee, vice president of technology at Indium Corporation.

Dr. Weiping Liu, research metallurgist at Indium Corporation.

Dr. Weiping Liu, research metallurgist at Indium Corporation.

Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, delivered a keynote presentation at the Electronics Packaging Symposium at Binghamton University on Oct. 8. Indium Corporation's Dr. Weiping Liu, research metallurgist, also presented at the symposium.

Dr. Lee’s keynote presentation, Prospects of Potential 3D and 2.5D Package Interconnect Materials, discussed a variety of considerations for selecting appropriate materials packaging including shape, joint resistance, bonding, and stability.

Dr. Liu’s presentation, Performance of SACm0510 Solder Alloy for Mobile Electronics Applications, discussed a new soldering alloy doped with Mn, and its improvements versus other solders on the market.

Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.

Liu received his Ph.D. in materials science and engineering from the Harbin Institute of Technology, China. Subsequently, he performed postdoctoral work at the Technical University of Berlin, Germany. Liu was a professor at the Dailan Jiatong University in China and a visiting scientist at the Max-Planck Institute for Metals Research in Stuttgart, Germany. He was affiliated with the Joining and Welding Research Institute (JWRI) in Osaka University, Japan, and was part of the Materials Science and Engineering Department at Lehigh University, Pa.

The Electronics Packaging Symposium focused on promising new technologies and developments that are impacting the electronics industry. Participants received overviews and research reports on a range of emerging technologies, including national trends, embedded electronics, thermal challenges, 3D packaging, sensors and MEMs, flexible electronics, high-temperature electronics, mobile electronics, and printed electronics and additive manufacturing.


Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.

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