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YINCAE Advanced Materials successfully exhibited at the 47th International Symposium on Microelectronics

Oct 24, 2014

(Albany, NY) October 21, 2014. YINCAE Advanced Materials, LLC wishes to thank all of
those who attended Dr. Yin’s presentation and those who visited our booth during the 47th
International Symposium on Microelectronics. YINCAE Advanced Materials staff was
pleased with the excellent attendance during the presentation by YINCAE President, Dr.
Wusheng Yin. His presentation was titled “Solderable Anisotropic Conductive Adhesives
for 3D Package Applications”. This advanced material presentation was given during
the technical sessions at the IMAPS 2014 International Microelectronics Symposium.
The technical sessions were held Oct 13th - 16th at the Towne & Country Conference
Center in San Diego, California.
The annual event also included a two day Exhibition from Oct 14th – 15th, allowing
YINCAE Staff to showcase an advanced Solder Joint Encapsulant Series SMT 256/266.
Technical and sales staff were available with Dr. Yin, during the exhibition, to address
questions on this Solder Joint Encapsulant Series and many other innovative electronic
assembly materials. Applications for the range of YINCAE Advanced Materials include;
wafer coating and wafer bonding, die attach, underfilling and product conformal coating.
YINCAE is a corporate member and sponsor of the global IMAPS organization,
(International Microelectronics Assembly and Packaging Society) with plans already in place to exhibit and present at the IMAPS 2015 conference. We look forward to seeing all of you at IMAPS 2015 in Orlando, Florida!
If you wish to read the white paper “SOLDERABLE ANISOTROPIC CONDUCTIVE ADHESIVES FOR 3D PACKAGE APPLICATIONS”, please click the following link: White Paper
Visit the web link at yincae.com for information on the Advanced Materials or email Taylor Farrell: tfarrell@yincae.com Phn # (518) 452-2880 at HQ in Albany, NY
                                        * * * * * * * * * *
YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.
                                             ###
The YINCAE brand name and logo are registered trademarks of YINCAE Advanced Materials, LLC.

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