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ERSASCOPE 2 Is the Only Optical Inspection System for Flip Chips and CSPs

Oct 22, 2014

Stephen Yun, V.P. of Operations, ACME PCB Assemb

Stephen Yun, V.P. of Operations, ACME PCB Assemb

Kurtz Ersa North America, a leading supplier of electronics production equipment, announces that it has delivered the new ERSASCOPE 2 to ACME PCB Assembly. Superior picture quality, increased light sensitivity and plug-and-play ease of use with USB 2.0 technology are just some of the capabilities that ACME PCB Assembly has gained with the ERSASCOPE 2.

We found that the ERSASCOPE 2 better enables us to find BGA quality issues such as cold soldering or solder peeling than X-ray inspection,” commented Stephen Yun, V.P. of Operations, ACME PCB Assembly. “The ERSASCOPE 2 gives our company another inspection layer to make sure the quality is excellent.”

The ERSASCOPE 2 uses megapixel, digital USB 2.0 camera technology offering up to 400 percent higher resolution than previous models. Enhanced images allow for increased clarity when zooming to higher magnifications, especially when using the revolutionary flip chip optical lens. A new metal halide light source offers a brighter white light and a mechanical iris adapter for additional gooseneck lighting with two standard fiber optic light brushes.

ACME PCB Assembly is an ISO 9000 certified printed circuit board assembly (PCBA) house located in Carson, California. The company provides PCB assembly for everything from consignment assembly to turnkey material procurement assembly, and has the tools required to manage the entire project efficiently. For more information about ACME PCB Assembly, visit www.acme-pcbassembly.com. 

For more information about Kurtz Ersa North America, visit www.ersa.com.

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