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News from KYZEN Corporation

KYZEN to Co-Present Understencil Wipe Cleaning Findings at IEMT 2014

Oct 13, 2014

KYZEN will present and exhibit at the 36th International Electronics Manufacturing Technology Conference (IEMT), scheduled to take place November 11-13, 2014 at the Renaissance Johor Bahru Hotel in Johor, Malaysia.

“Understencil Wipe Cleaning Yield Improvements” was written by KYZEN’s Mike Bixenman, D.B.A., Shea Engineering’s Chrys Shea, Vicor Corporation – VI Chip Division’s Ray Whittier, and Indium Corporation’s Brook Sandy-Smith. The findings will be presented by KYZEN Sdn Bhd’s Technical Sales Manager TC Loy.

Understencil wiping has gained increased interest over the last several years. Changes in circuit design due to miniaturized components and highly dense interconnects have increased the importance of stencil cleanliness, both inside the aperture wall and on the seating surface of the stencil. In most stencil printing processes, dry wiping the stencil’s bottom side has been followed by vacuum assist in an effort to remove excess solder paste from aperture walls. As stencil apertures reduce in size, more frequent wiping is needed to assure that stencils are free of the excess solder paste that hampers their process performance. To improve print performance and better understand the behavior of flux-stencil interactions, two technology approaches are being studied with higher levels of frequency: a nanoscale flux-repellent coating and wetting the understencil wipe with a solvent-based cleaning agent.

The International Electronics Manufacturing Technology (IEMT) Conference is the premier IEEE event devoted to the manufacture of electronic, optoelectronic and MEMS/sensors devices and systems. IEMT is an established International conference of long standing organized by the Components Packaging and Manufacturing Technology (CPMT) Society of IEEE. IEMT 2014 will feature short courses, technical sessions and exhibitions. It aims to provide good coverage of technological developments in all areas of electronics packaging, from design to manufacturing and operation.

For more information about the IEMT conference and exhibition, visit For more information about KYZEN’s participation, visit

KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, visit

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