SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Nordson DAGE


Dr. Evstatin Krastev from Nordson DAGE to Present Two Ground-breaking X-ray Inspection Studies during the Technical Sessions at SMTAI 2014

Aug 28, 2014

Dr. Evstatin Krastev

Dr. Evstatin Krastev

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Dr. Evstatin Krastev, Director of Applications, will present two papers at the upcoming SMTA International exhibition. One of the papers is a joint study with the Flextronics International team. Both presentations will be held during Session PRC1, “Radiography Techniques for Inspection of Advanced Electronic Packages,” and will take place Tuesday, Sept. 30, 2014 from 2-3:30 p.m. in Room 51 at the Donald Stephens Convention Center in Rosemont, IL.

John Tingay, Technical Director, X-ray Products at Nordson DAGE and Dr. Krastev co-authored the paper entitled, “X-ray / Bondtester Reliability Study of BGA Devices – Impact of Interfacial Voiding.” To date, there have been no quantitative studies trying to explain the impact of interfacial voiding on joint reliability and compare this to the impact of the voiding that is located within the bulk of the solder joint.  In this study, the Large Board CT technique was used in conjunction with the well-established method of Bondtest Shear in an effort to correlate the bond strength as measured by the shear test to the size and location of the voiding as determined by the Large Board CT.  In an effort to achieve good statistical significance, a very large sample of BGA devices mounted on PCBs is utilized. To speed up the process, various levels of automation for both the Bondtester and X-ray measurements are employed.

Flextronics and Nordson DAGE partnered to write the paper entitled, “Optimizing X-ray Inspection with Package on Package.” Dr. Krastev co-authored the paper with Zhen (Jane) Feng, Ph.D., David Geiger, Weifeng Liu, Ph.D., Hung Le, Tho Vu, Anwar Mohammed and Murad Kurwa, Flextronics International. Achieving the best possible PoP solder joint quality has become increasingly important consideration for the PCBA manufacturers.  Most of the solder joints of a PoP device are invisible by optical means, thus X-ray inspection is the only way to examine POP solder quality in a non-destructive way. As a consequence it is becoming more frequently used at the SMT lines. It is very important for the PCBA manufacturers to be able to test PoP using Automated X-Ray Inspection (AXI) within the SMT line. The goals for this project were as follows: 1. Understand current AXI capabilities detecting PoP defects; 2. Explore ways to optimize the AXI algorithms in order to improve defect detection; 3. Try to develop a process for AXI algorithm optimization. 


Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries.  For more information, visit www.nordsondage.com.


Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service.  Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing.  Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries.  Visit Nordson on the web at www.nordson.com, www.twitter.com/Nordson_Corp  or www.facebook.com/nordson.

You must be a registered user to talk back to us.

More News from Nordson DAGE

Nov 07, 2016 -

Nordson DAGE Announces Cabiotec as European X-ray Distributor of the Year for X-ray Systems 2016

Oct 06, 2016 -

Nordson DAGE Receives a Global Technology Award for Inspection – X-ray

Aug 30, 2016 -

Nordson DAGE to Show the Ultimate Flexible X-ray System – the Quadra™ 5

Aug 14, 2016 -

Nordson DAGE Announce European Distributor Network Changes

Jul 30, 2016 -

Nordson to Showcase Market-Leading Test and Inspection Systems at NEPCON South China

Jun 19, 2016 -

Nordson DAGE Will Show the New Quadra™ 7 X-ray Inspection System for the First Time at SEMICON West

Jun 13, 2016 -

Nordson DAGE Opens Asian Clean Room Demonstration Facility for XM8000 and Bondtester Wafer Metrology Tools

Apr 26, 2016 -

Nordson DAGE Launch the New Quadra™ X-ray Inspection Series

Apr 04, 2016 -

Nordson to Exhibit Full Range of Market Leading Test and Inspection Systems at SMT/Hybrid/Packaging 2016

Feb 17, 2016 -

Nordson Test & Inspection to Show Market-leading X-ray Inspection Systems at APEX

(100) more news from Nordson DAGE

Dr. Evstatin Krastev from Nordson DAGE to Present Two Ground-breaking X-ray Inspection Studies during the Technical Sessions at SMTAI 2014 news release has been viewed 804 times

Plasma Prior to Conformal Coating

PCB X-Ray Inspection System