SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News


Field Application Engineer Tony Lentz to Present at SMTAI

Aug 28, 2014

Tony Lentz

Tony Lentz

FCT Assembly today announced that Field Application Engineer Tony Lentz will present paper titled “Performance Enhancing Nano Coatings: Changing the Rules of Stencil Design” at the upcoming SMTA International exhibition. The presentation will be held during Session SMT4, “Stencil Printing Advances for Today’s Electronics,” and will take place Wednesday, October 1, 2014 from 10:30 a.m.-12 p.m. in Room 47 at the Donald Stephens Convention Center in Rosemont, IL.

Nano coatings are applied to solder paste stencils with the intent of improving the solder paste printing process.  Do they really make a noticeable improvement?  The effect of nano coatings on solder paste print performance was investigated. Transfer efficiencies were studied across aperture sizes ranging from 0.300 to 0.800 area ratio. The effects of nano coatings on transfer efficiencies of tin-lead, lead-free, water soluble, no-clean, and type 3, 4, and 5 solder pastes also was studied. Solder paste print performance for each nano coating was summarized with respect to all of these variables. 

Standard industry rules for stencil aperture design suggest that area ratios be kept above 0.66 for acceptable transfer efficiency. The intent of this rule is to ensure that solder paste volume is adequate for an acceptable process window.  Nano coatings; however, are changing this rule. Guidelines for stencil design are recommended based on the performance of nano coatings.
Lentz has been in the electronics industry since 1994, and worked as a process engineer at a circuit board manufacturer for five years. He has extensive experience performing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards. Additionally, Lentz has been involved with APEX for many years. He holds B.S. and M.B.S. degrees in chemistry.

FCT Assembly consists of three divisions: FCT Solder, Fine Line Stencil and A-Laser. With numerous facilities in the United States, FCT is one of the electronics industry’s leading manufacturers of lead-free and leaded solder products, superior quality stencils and precision cut parts.

The company sets itself apart from its competitors by continuously studying new products and processes in order to uphold its reputation as a leader in technology. FCT’s customers can always count on the company to use the latest technology and to supply products with the highest quality.For more information, visit

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