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Advanced Webinar “Cleaning Bottom Termination Components” Presented by ZESTRON

Aug 07, 2014

ZESTRON, the global leading provider of high precision cleaning products, services and training solutions, is pleased to announce the eighth session of ZESTRON Academy’s Ten-part 2014 Cleaning Webinar Series titled "Technical Study: Cleaning Bottom Termination Components."  This 45 min. webinar is part of ZESTRON Academy’s Advanced Curriculum, presented by Umut Tosun, M.S.Chem.Eng., Application Technology Manager of ZESTRON America, and is scheduled for August 21st at 1:00 pm EDT.

What will you learn?
As one of the fastest growing package types within the electronics industry, Bottom Termination Components connect integrated circuits to printed circuit boards. However, the leads are located underneath the component body thereby inhibiting cleaning after the soldering process. Learn how to define and validate the optimal cleaning process parameters for Bottom Termination Components.

Who should attend?
The content of this webinar is designed for production line operators, manufacturing and quality managers as well as process engineers within the electronics manufacturing industry.

For more information or to register, please contact ZESTRON at infousa@zestron.com, or visit ZESTRON Academy.


Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With six worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information and to tour one of our unparalleled technical centers, please visit www.zestron.com.

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