SMT, PCB Electronics Industry News

BTU to Exhibit Thermal Processing Duo at NEPCON South China

Jul 28, 2014

DYNAMO

DYNAMO

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, today announced that it will exhibit the award winning DYNAMO™ and PYRAMAX™  in booth B-1F55 at NEPCON South China, scheduled to take place August 26-28, 2014, at the Shenzhen Convention & Exhibition Center in China.

With 8, 10, and 12 zone air or nitrogen models available, DYNAMO represents BTU’s commitment to quality and reliability. DYNAMO’s simplified configuration delivers 24/7, with high uptime and reduced cost of ownership.

Also on display, BTU’s PYRAMAX convection reflow oven is the benchmark for performance in the industry.  The PYRAMAX features a maximum temperature of 400° C and a comprehensive menu of options. PYRAMAX systems, featuring BTU’s exclusive closed-loop convection technology, provide optimized lead-free processing for the ultimate in productivity and efficiency.

Both products are backed by BTU’s worldwide network of service and applications professionals. For more information, meet with company representatives at NEPCON China or visit www.btu.com.


BTU International is a global supplier and technology leader of advanced thermal processing equipment and processes to the electronics manufacturing and alternative energy markets. BTU equipment is used in the production of printed circuit board assemblies and semiconductor packaging as well as in the manufacturing of solar cells and nuclear fuel. BTU has operations in North Billerica, Massachusetts and Shanghai, China with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.
 

Aug 15, 2017 -

BTU Launches New Development at SMTAI to Support Industry 4.0

May 16, 2017 -

BTU Announces NextFlex as Its Newest Demo Site for the PYRAMAX Reflow Oven

May 02, 2017 -

BTU International Receives 30th Award for Advanced Thermal Processin

Apr 25, 2017 -

BTU’s New Dual Chamber Reflow System Awarde d during NEPCON China 2017

Apr 22, 2017 -

BTU to Demo the Updated WINCON Control System at SMT Hybrid Packaging 2017

Mar 16, 2017 -

BTU to Demo Its Dual Chamber Reflow Oven & Industry 4.0 Advances at NEPCON China

Mar 09, 2017 -

BTU to Show New WINCON Interface Features at Southern Manufacturing

Feb 12, 2017 -

BTU to Participate in “Making Reflow Ovens Smart” Panel Session at APEX

Jan 10, 2017 -

BTU Set to Launch the PYRAMAX ZeroTurn Dual Chamber System at APEX

Sep 12, 2016 -

BTU & SMarTsol to Demo RecipePro on PYRAMAX Oven at SMTA Guadalajara

204 more news from BTU International »

Aug 19, 2017 -

See Latest Dispense Technology Demonstrations From GPD Global at NEPCON 2017

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

Aug 17, 2017 -

Libra Industries Announces Two 20-Year Service Awards in Q2 2017

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 -

What is SMT and where to by SMT spare parts

Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

See electronics manufacturing industry news »

BTU to Exhibit Thermal Processing Duo at NEPCON South China news release has been viewed 606 times

reflow oven profiler

PCB 3D AOI