Ultra Small Form Factors Targeting Power-efficient Mobile Applications for Fast Time-to-market and High Reliability.
ADLINK Technology, Inc. today introduces a new SMARC form factor computer-on-module running on Intel x86 processors. Using a single, dual, or quad core Intel® Atom™ processor E3800 series system-on-chip from 1.3 to 2.2 GHz with soldered memory up to 4GB DDR3L at 1066/1333 MHz including ECC, the ADLINK LEC-BT product delivers top-of-the-line performance in efficient power use that targets a new generation of mobile applications with industrial-grade stability and reliability.
The SMARC (Smart Mobility ARChitecture) is a versatile ultra small footprint computer-on-module defined predominantly by ADLINK and Kontron and approved by the SGET (Standardization Group for Embedded Technology) Consortium. SMARC is an open and global standard for new generation embedded applications featuring low power, low cost and high performance, taking advantages from both legacy x86 and ARM-based designs. ADLINK previously released SMARC modules with ARM-based cores.
The ADLINK LEC-BT is a full size 82 mm x 80 mm module with onboard eMMC flash and ECC memory support. The low power design of SMARC (5 W to 10 W depending on number of cores and usage) allows for passive heat dissipation and enables smaller, quieter and cleaner systems. Although it is a small form factor, LEC-BT provides a variety of I/O interfaces for developing innovative new applications, including both legacy PC interfaces such as PCIe, SATA and HDMI, and modern ARM-like interfaces such as SPI, I2C, I2S. GbE is also provided for Ethernet connection, and other interfaces are included for a MIPI CSI compliant camera, USB2.0 and 3.0 (host and client), GPIO, and serial ports.
LEC-BT is designed for portable, or small stationary systems with application scenarios ranging from industrial automation, medical testing and measurement, to transportation and digital signage, especially for systems requiring high graphic performance in mobile applications. The LEC-BT modules can operate in an extremely wide temperature range from -40 to +85OC due to ADLINK’s proven Extreme Rugged™ technology.
ADLINK Technology today announced that its latest SMARC form factor module, the LEC-BT, is certified by Intel for Intel® Gateway Solutions for the Internet of Things (IoT) using Windriver and McAfee software integration. Paired with ADLINK’s device-to-cloud platform SEMA Cloud (Smart Embedded Management Agent) that enables remote monitoring control and management, the LEC-BT is an ideal building block for developing IoT devices with a secure interconnection to the cloud.
ADLINK Technology is enabling the Internet of Things (IoT) with innovative embedded computing solutions for edge devices, intelligent gateways and cloud services. ADLINK’s products are application-ready for industrial automation, communications, medical, defense, transportation, and infotainment industries. Our product range includes motherboards, blades, chassis, modules, and systems based on industry standard form factors, as well as an extensive line of test & measurement products and smart touch computers, displays and handhelds that support the global transition to always connected systems. Many products are Extreme Rugged™, supporting extended temperature ranges, shock and vibration.
ADLINK is a Premier Member of the Intel® Internet of Things Solutions Alliance and is active in several standards organizations, including PCI Industrial Computer Manufacturers Group (PICMG), PXI Systems Alliance (PXISA), and Standardization Group for Embedded Technologies (SGET).
ADLINK is a global company with head quarters in Taiwan and manufacturing in Taiwan and China; R&D and integration in Taiwan, China, the US, and Germany; and an extensive network of worldwide sales and support offices. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on the TAIEX Taiwan Stock Exchange (stock code: 6166).