SMT, PCB Electronics Industry News

MIRTEC to Introduce MV-9 SIP and MP-7 MICRO at SEMICON West

Jun 22, 2014

MP-7 MICRO

MP-7 MICRO

MV-9 SIP

MV-9 SIP

MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA. The MV-9 SIP and MP-7 MICRO will be displayed for the first time.

The industry demands for higher levels of semiconductor integration and lower costs continue to drive the popularity of System in Package (SiP) solutions. SiP devices are characterized by any combination of one or more Integrated circuits of different functionalities, which may include passive components and MEMS assembled into a single package that performs as a system or sub-system. SiP devices may contain wire bonded ICs, flip chips and host discrete components that are traditionally found on system mother boards. MIRTEC’s MV-9 SIP System was designed to specifically address the precision inspection requirements associated with these advanced semiconductor solutions. The MV-9 SIP is configured with MIRTEC’s award-winning OMNI-VISION® 2D/3D Inspection Technology that combines an exclusive 25MP CoaXPress 2D ISIS Vision System with MIRTEC’s revolutionary Digital Multi-Frequency Quad Moiré 3D system to provide precision inspection of semiconductor assemblies. The MV-9 SIP system also features four (4) 10 Mega Pixel Side-View Cameras in addition to the 25 Mega Pixel Top-Down Camera.

As Ball Grid Array (BGA) manufacturing grows in popularity, replacing many gull wing fine-pitch packaged components, there is an increasing demand for inspection equipment that can verify the integrity of BGA device packages post fabrication. MIRTEC’s MP-7 MICRO is a highly specialized system designed specifically for precision BGA ball inspection. The MP-7 MICRO is configured with MIRTEC’s exclusive 15 MP ISIS Vision System, a Precision 6 Micron Telecentric Compound Lens and color strobe LED lighting.


MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry.  For further information, please visit www.mirtec.com.

Sep 18, 2017 -

MIRTEC to Exhibit Its Award-Winning MV-6 OMNI 3D AOI System at SMTA Guadalajara

Sep 18, 2017 -

MIRTEC Europe Awarded EM Best of Industry 2017 for AOI

Aug 14, 2017 -

MIRTEC to Exhibit Their Award-Winning 3D AOI and 3D SPI Systems at SMTAI 2017

Jul 18, 2017 -

Mirtec Europe Announces Winner of Annual Charity Event

Apr 24, 2017 -

MIRTEC TO EXHIBIT A NEW INSPECTION SYSTEM WITH THE PERFECT INSPECTION SOLUTION AT NEPCON CHINA 2017

Apr 22, 2017 -

MIRTEC Europe to Exhibit at SMT/Hybrid/Packaging 2017

Apr 03, 2017 -

MIRTEC Europe to Exhibit at What's New in Electronics Live! Event

Feb 15, 2017 -

MIRTEC WINS PRESTIGIOUS 2017 SERVICE EXCELLENCE AWARD FOR TEST & INSPECTION

Jan 23, 2017 -

MIRTEC REPORTS RECORD SALES REVENUE 2016

Jan 11, 2017 -

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2017

129 more news from MIRTEC Corporation »

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -

COT Announces PB Swiss Tools’ Two New INSIDER Models: INSIDER STUBBY and INSIDER STUBBY RATCHET

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

Sep 19, 2017 -

BTU Introduces Profile Guardian Redundant Process Monitor during SMTAI

See electronics manufacturing industry news »

MIRTEC to Introduce MV-9 SIP and MP-7 MICRO at SEMICON West news release has been viewed 1157 times

Rework Training Materials

Fully automatic selective soldering stations