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Nordson DAGE Technical Experts to Exhibit X-ray and Bondtesting Equipment at SEMICON West

Jun 04, 2014

4000Plus Bondtester

4000Plus Bondtester

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces it will exhibit in Booth #5744 and 1314 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA. Attendees are encouraged to make an appointment now and bring a sample for discussion to Nordson DAGE’s X-ray inspection experts. Technical experts will showcase the company’s world-class X-ray and Bondtesting equipment.

The Nordson DAGE XD7600NT Diamond X-ray inspection system provides 0.1 µm feature recognition and up to 10 W of power, together with the 2 Mpixel XiDAT3 digital image detector, thus making it the of choice for the highest performance and highest magnification imaging tasks. The system will be displayed with the Nordson DAGE µCT inspection option that provides Computerized Tomography (CT) functionality to compliment the 2D X-ray investigations on Nordson DAGE X-ray inspection systems.

The 4000 Optima Bondtester delivers unrivalled performance, to meet and exceed test standards, combined with ultimate speed and flexibility. The combination of patented technology and superior ergonomics with intelligent and intuitive software makes the 4000 Optima the number one production bond tester; providing repeatable and reproducible results.

The 4000Plus Bondtester represents the new industry standard in bond testing with unsurpassed data accuracy and repeatability.  Nordson DAGE bond test technology meets the requirements of emerging test applications including ribbon pull, pad cratering using hot pin pull, bend and fatigue testing. The 4000Plus bondtester uses the next-generation Paragon™ software providing semi-automatic test routines, automatic GR&R calculation, unique database search engine wizard and superior data reporting.

In Booth 1413, Nordson DAGE representatives will highlight the new XM8000 Wafer X-ray Metrology Platform that provides fast automatic X-ray measurement of TSVs, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions. This new platform takes the market-leading capabilities from Nordson DAGE’s existing X-ray systems to provide an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features.

To schedule your appointment, contact your local Nordson DAGE sales representative or e-mail dagesalesUS@nordsondage.com. For more information about Nordson DAGE, visit www.nordsondage.com.


Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries.  For more information, visit www.nordsondage.com.


Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service.  Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing.  Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries.  Visit Nordson on the web at www.nordson.com, www.twitter.com/Nordson_Corp  or www.facebook.com/nordson.

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