SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Indium Corporation

Indium Corporation, Kyzen Host Seminar in Taiwan

May 15, 2014

Indium Corporation and Kyzen hosted a technical seminar on April 29 in Hsinchu, Taiwan. 

The seminar featured presentations by Sze Pei Lim, Indium Corporation’s technical manager for Southeast Asia, and Jason Chan, Kyzen’s technical applications manager. Each presented on a variety of topics, including low temperature alloys, cleaning semiconductor devices, and new technologies.

Sze Pei is responsible for managing Indium Corporation’s technical teams throughout the Asia-Pacific region. She joined Indium Corporation in 2007 as an area technical manager. She earned her bachelor’s degree in Chemistry from the National University of Singapore, and has 17 years of experience in the SMT and PCB assembly industries.

Chan has nine years of experience in semiconductor applications and electronics packaging assemblies, including wafer-bumping processes, flip-chip packaging, LED packaging, passive and hybrid components, PCB assembly applications, and more. He earned his bachelor’s degree in computer information systems from the University of Detroit Mercy in Mich., USA.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

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