The Surface Mount Technology Association (SMTA) has issued a call for papers for the 2014 Pan Pacific Microelectronics Symposium, which will be held 3 - 5 February 2015 on Kauai, Hawaii. The symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly.
The 2015 event is special as it will celebrate 20 years since its inauguration. The esteemed technical and advisory committees are planning the most robust conference to date with new technical tracks covering even greater depth of research.
The deadline for abstracts is June 16, 2014. Papers should be 6-10 pages in length including graphics, and they should offer non-commercial research results on any of the topics listed below.
Featured topics include:
- New Manufacturing Paradigms
- 3D Thermal Management
- Interposer Assembly
- 3D/TSV & Heterogeneous Integration
- Connection Taxonomy
- Embedded Assembly
- Green Electronics Materials & Processes
- Manufacturing Process Control
- Nano-Tech in Electronics Systems
- Power Electronics
- Prognostics & Health Management
- Integrated Simulation & Modeling
- Medical Systems
- Roadmaps & Industry Trends
- Eco Design in Electronics
- Reliability & Failure Analysis
Please submit abstracts of 500 words with title and author contact information to JoAnn Stromberg, email@example.com, or online at http://smta.org/panpac/call_for_papers.cfm.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.