SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Formula E s.r.l. and Engineered Materials Systems, Inc. Enter Collaboration Agreement

Formula E s.r.l. and Engineered Materials Systems, Inc. Enter Collaboration Agreement

May 07, 2014

Formula E s.r.l., a leading supplier of photovoltaic technology and automated manufacturing lines, and Engineered Materials Systems, a leading supplier of conductive interconnect materials for photovoltaic applications, have entered into an agreement for the development of electrically conductive adhesives for use on Formula E automated manufacturing lines. The companies will introduce the FE-106 Low Cost Conductive Adhesive for back contact applications in crystalline silicon solar modules at exhibits W4-510 (Formula E @ Coveme booth) and N1-110 (EMS) at the 8th SNEC Power Expo 2014, scheduled to take place May 20-22, 2014 at the Shanghai New International Expo Center in Shanghai, China.

FE-106 is the first material developed under the collaboration agreement that is designed to make contact from vias or other conductors on the solar cells to the back contact sheet. The companies used EBfoil manufactured by Coveme s.p.a.  for the back contact sheets in several repeated tests and production runs.

The adhesive is stress absorbing to withstand the rigors of thermal cycling, and features excellent conductive stability to back contact metallizations during damp heat exposure. The FE-106 conductive adhesive is designed to cure through the encapsulant lamination and cure process. This material is approximately 60 percent lower cost than standard silver filled adhesives. When linked to Formula E proprietary technology and process, it grants higher performance levels and power output from the high efficiency PV modules compared with any other conductive adhesive.

Company representatives will be available at the show to discuss Formula E photovoltaic solutions at exhibit W4 -510 (Formula E @ Coveme booth) and Engineered Materials Systems’ electrically conductive adhesives at exhibit N1-110.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.


Formula E s.r.l. is an Italian company with a talented team with long and deep experience and heritage in solar industry, automation, Automated Optical Inspection, software and mechatronics for application requiring high precision and accuracy in mass production. The company creates continual improvements and developments in the equipment and process dedicated to PV modules manufacturing, providing a complete and broad variety and platform of innovative solutions solving requirements from laboratory to mass production and enabling quite different technology roadmaps in the PV industry.

Dec 04, 2019 -

Engineered Material Systems Introduces Linear Resistance Carbon Inks

Jun 15, 2019 -

Engineered Material Systems Introduces Durable Printed Electronics with SMT

May 13, 2019 -

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Apr 15, 2019 -

Engineered Material Systems to Showcase Electrically Conductive Adhesives at Intersolar Europe

Feb 21, 2019 -

EMS Introduces Spin on Liquid Negative Photoresist NR-5000

Jan 15, 2019 -

Engineered Material Systems Introduces New High thermal Conductivity Die and Component Attach Adhesive

Sep 27, 2018 -

EMS introduces 5 μm thick dry film negative photoresist DF-3505 for metallization processes

Sep 13, 2018 -

Engineered Material Systems to Showcase Next-Generation Electrically Conductive Adhesives at EU PVSEC

Sep 05, 2018 -

Engineered Material Systems Introduces New Low-Temperature Cure, Low-Cost, Electrically Conductive Adhesive

Jun 11, 2018 -

Engineered Material Systems to Showcase Next Generation Electrically Conductive Adhesives at Intersolar Europe

67 more news from Engineered Materials Systems, Inc. »

Apr 19, 2024 -

ViTrox Pioneering the Future of Smart Manufacturing at NEPCON China 2024! Booth #1H27

Apr 18, 2024 -

ViTrox Technologies Elevates Service & Support Across US & Canada with Jeremy Woodworth's Appointment!

Apr 16, 2024 -

I.C.T | Your One-Stop Service for Smart Meter SMT Factory

Apr 15, 2024 -

Three Industry Leaders Receive IPC President's Award

Apr 15, 2024 -

IFTEC's Pierre-Jean Albrieux Inducted into the IPC Raymond E. Pritchard Hall of Fame at IPC APEX EXPO 2024

Apr 15, 2024 -

IPC Honors Summit Interconnect and Robert Bosch GmbH with Corporate Recognition Awards

Apr 15, 2024 -

IPC Publishes Comprehensive Strategy to Address Electronics Industry's Global Workforce Challenge, Calls on Leaders in Government, Business and Education for Support

Apr 15, 2024 -

Data I/O Announces Major Milestone with 500th PSV System Sale Ahead of IPC APEX Expo

Apr 15, 2024 -

IPC Announces New Board Members at IPC APEX EXPO 2024

Apr 15, 2024 -

Seika Machinery Recognizes Outstanding Sales Achievements at 2024 IPC APEX EXPO

See electronics manufacturing industry news »

Formula E s.r.l. and Engineered Materials Systems, Inc. Enter Collaboration Agreement news release has been viewed 1032 times

  • SMTnet
  • »
  • Industry News
  • »
  • Formula E s.r.l. and Engineered Materials Systems, Inc. Enter Collaboration Agreement
Jade Series Selective Soldering Machines

Conductive Adhesive & Non-Conductive Adhesive Dispensing