SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Formula E s.r.l. and Engineered Materials Systems, Inc. Enter Collaboration Agreement

Formula E s.r.l. and Engineered Materials Systems, Inc. Enter Collaboration Agreement

May 07, 2014

Formula E s.r.l., a leading supplier of photovoltaic technology and automated manufacturing lines, and Engineered Materials Systems, a leading supplier of conductive interconnect materials for photovoltaic applications, have entered into an agreement for the development of electrically conductive adhesives for use on Formula E automated manufacturing lines. The companies will introduce the FE-106 Low Cost Conductive Adhesive for back contact applications in crystalline silicon solar modules at exhibits W4-510 (Formula E @ Coveme booth) and N1-110 (EMS) at the 8th SNEC Power Expo 2014, scheduled to take place May 20-22, 2014 at the Shanghai New International Expo Center in Shanghai, China.

FE-106 is the first material developed under the collaboration agreement that is designed to make contact from vias or other conductors on the solar cells to the back contact sheet. The companies used EBfoil manufactured by Coveme s.p.a.  for the back contact sheets in several repeated tests and production runs.

The adhesive is stress absorbing to withstand the rigors of thermal cycling, and features excellent conductive stability to back contact metallizations during damp heat exposure. The FE-106 conductive adhesive is designed to cure through the encapsulant lamination and cure process. This material is approximately 60 percent lower cost than standard silver filled adhesives. When linked to Formula E proprietary technology and process, it grants higher performance levels and power output from the high efficiency PV modules compared with any other conductive adhesive.

Company representatives will be available at the show to discuss Formula E photovoltaic solutions at exhibit W4 -510 (Formula E @ Coveme booth) and Engineered Materials Systems’ electrically conductive adhesives at exhibit N1-110.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.


Formula E s.r.l. is an Italian company with a talented team with long and deep experience and heritage in solar industry, automation, Automated Optical Inspection, software and mechatronics for application requiring high precision and accuracy in mass production. The company creates continual improvements and developments in the equipment and process dedicated to PV modules manufacturing, providing a complete and broad variety and platform of innovative solutions solving requirements from laboratory to mass production and enabling quite different technology roadmaps in the PV industry.

Jan 28, 2018 -

Engineered Material Systems Introduces a New Two-Component Epoxy Encapsulant (506-03A/B)

Jan 28, 2018 -

Engineered Material Systems to Showcase Jet Dispense SMT at IPC APEX EXPO

Dec 05, 2017 -

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Dec 03, 2017 -

Engineered Material Systems Introduces a New Low-Temperature Cure Electrically Conductive Adhesive

Oct 22, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Oct 18, 2017 -

Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules

Sep 13, 2017 -

Engineered Material Systems to Showcase Liquid and Dry Film Negative Tone Photoresists at MicroTAS

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 10, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer Level Packaging

May 01, 2017 -

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at Intersolar Europe

54 more news from Engineered Materials Systems, Inc. »

Feb 15, 2018 -

New LTE End-to-End Solution for Private Networks Meets Security, Latency Requirements for IoT and Industrial 4.0 ADLINK and MECSware to demonstrate Private LTE at Mobile World Congress

Feb 15, 2018 -

Altek Electronics, Inc. Purchases Ersa’s Smartflow Selective Soldering System

Feb 15, 2018 -

CalcuQuote and Sager Partner Up on Real Time Inventory Integration

Feb 14, 2018 -

SJ InnoTech introduces the low cost HP-520E Printer

Feb 14, 2018 -

Umut Tosun to Instruct Professional Development Course at IPC APEX 2018

Feb 14, 2018 -

John Hengst Joins Inovaxe as Regional Sales and Channel Partner Manager

Feb 14, 2018 -

optical control GmbH to Display SMD Counting Machine at APEX

Feb 14, 2018 -

Show Floor Sells Out for IPC APEX EXPO 2018

Feb 14, 2018 -

PDR Offers IPC 7711/7721 Rev. C Courses

Feb 14, 2018 -

Press Release: DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials

See electronics manufacturing industry news »

Formula E s.r.l. and Engineered Materials Systems, Inc. Enter Collaboration Agreement news release has been viewed 1343 times

  • SMTnet
  • »
  • Industry News
  • »
  • Formula E s.r.l. and Engineered Materials Systems, Inc. Enter Collaboration Agreement
Ecolloy Soldering Alloy

Cogiscan Track Trace Control