ZESTRON, the global leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing industry, will host a free “Assembly, Cleaning, and Reliability” workshop together with Indium Corporation, Speedline Technologies, and Competitive Edge Solutions in Franklin, MA on June 10th, 2014.
Learn about PCB failure mechanisms, solder paste challenges, surface analytics, and participate in hands-on demonstrations during an interactive learning session.
Derrick Herron, Technical Support Engineer, Indium Corporation, will be presenting “Various Ways to Minimize Voiding Under Bottom Terminated Components” followed by “Improving Fine Pitch Printing” presented by Dave Hemmelgarn, Sr. Sales and Application Engineer of Speedline Technologies – MPM.
Ravi Parthasarathy, M.S.Chem.Eng., Senior Process Engineer, ZESTRON, will be presenting a two part session, “Why Clean PCBs” and “Process Control and Cleanliness Assessment.” The final presentation, “Effective Cleaning of Low Standoff Devices within a Batch Cleaner,” will be given by Jody Saultz, Application Engineer, Speedline Technologies – Electrovert. This event will be concluded with lab demonstrations and a panel discussion featuring each presenter.
This workshop includes a complimentary breakfast and lunch, and will be held at Speedline Technologies, 16 Forge Pkwy, Franklin, MA. For more information and to register for this workshop, please visit www.zestron.com.
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With six worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.For additional information and to tour one of our unparalleled technical centers, please visit www.zestron.com.