SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Material Systems Debuts DF-4017 Hydrophobic Dry Film Negative Photoresist

Engineered Material Systems Debuts DF-4017 Hydrophobic Dry Film Negative Photoresist

May 05, 2014

Engineered Material Systems, Inc. (EMS), a leading global supplier of negative photoresist materials for MEMs and IC cooling applications, introduces the DF-4017 Dry Film Negative Photoresist for use in micro-electromechanical systems (MEMS). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

DF-4017 film was developed to produce extremely hydrophobic (>90° contact angle) film surfaces. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-4017film is tougher (less brittle) than most negative photoresists in the market with a glass transition temperature of 145°C (by DMA Tan Delta) and a moderate modulus of 4.5 GPa at 25°C. The cured chemistry is hydrophobic in nature, providing excellent chemical and moisture resistance.

DF-4017 film is compatible with and can be used in contact with the EMS line of spin coating photoresist. DF-4017 dry-film photoresist is the latest addition to EMS’ full line of film and liquid negative photo resists formulated for making microfluidic channels and permanent features on MEMS devices and integrated circuits.

For more information about the new DF-4017 Dry Film Negative Photoresist or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive, printed electronics and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.

Dec 05, 2017 -

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Dec 03, 2017 -

Engineered Material Systems Introduces a New Low-Temperature Cure Electrically Conductive Adhesive

Oct 22, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Oct 18, 2017 -

Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules

Sep 13, 2017 -

Engineered Material Systems to Showcase Liquid and Dry Film Negative Tone Photoresists at MicroTAS

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 10, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer Level Packaging

May 01, 2017 -

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at Intersolar Europe

Apr 22, 2017 -

New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging

Mar 22, 2017 -

Engineered Material Systems Introduces New UV Cured Adhesive for Bonding Lens Holders in Camera Modules

52 more news from Engineered Materials Systems, Inc. »

Jan 17, 2018 -

Inovaxe to Showcase Its Intelligent Ultra-Lean Total Material Handling and Storage Solution at SMTA Space Coast Expo

Jan 17, 2018 -

Schleuniger Introduces CableCoiler 1450 Single Pan Coiling System

Jan 17, 2018 -

Schleuniger Introduces CableCoiler 1450 Single Pan Coiling System

Jan 17, 2018 -

Schleuniger Introduces CableCoiler 1450 Single Pan Coiling System

Jan 17, 2018 -

CalcuQuote Exhibits at IPC APEX Expo 2018

Jan 17, 2018 -

Data I/O Expands Market Leading LumenX Platform to Support Universal Flash Storage (UFS)

Jan 16, 2018 -

Female Leaders in Tech, Everywhere rising high as mentor Michelle Ogihara joins as Ambassador for the U.S.

Jan 16, 2018 -

Preview for IPC Apex 2018 San Diego, booth # 3007 JTAG Visualizer Update Adds Features for Faster Debug Assess PCB assembly fault coverage and find board build errors quicker

Jan 16, 2018 -

Seika’s Michelle Ogihara Joins FLITE as Ambassador for the U.S.

Jan 16, 2018 -

Libra Industries Achieves NIST SP 800-171 Compliance

See electronics manufacturing industry news »

Engineered Material Systems Debuts DF-4017 Hydrophobic Dry Film Negative Photoresist news release has been viewed 1215 times

  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Material Systems Debuts DF-4017 Hydrophobic Dry Film Negative Photoresist
IPC Training & Certification - Blackfox

PCB Assembly Equipment Auctions