SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Indium Corporation


Indium10.1 Pb-Free Solder Paste Provides Lowest Voiding Levels for Large Ground Planes

Apr 30, 2014

Indium Corporation’s Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.

The oxidation-inhibiting properties of Indium10.1 promote industry-leading head-in-pillow and graping resistance, with complete coalescence, even after long reflow profiles. The exceptional soldering ability of Indium10.1 makes it the best solution for components with less-than-ideal solderability and challenging RF shield metallizations.

Indium10.1 enables the lowest cost of ownership to PCB assembly manufacturers through an all-around balanced performance in both high print and soldering yields. It boasts a versatile, well-balanced set of properties with best-in-class printing and soldering performance. Indium10.1 provides industry-leading print definition and transfer efficiency, low voiding performance, and head-in-pillow and graping resistance.

Indium10.1 Solder Paste is part of Indium Corporation’s family of high performance, lead-free solder pastes. The series was designed to provide multi-faceted performance characteristics, bringing the right balance of solder paste attributes tailored specifically to each specific manufacturing process. Each paste in the series was developed to optimize print performance and mitigate common defects faced by manufacturers of personal electronics, such as QFN voiding, head-in-pillow, and graping.

Learn more about Indium10.1 and the Pb-free Solder Paste series from Indium Corporation.


Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

You must be a registered user to talk back to us.

More News from Indium Corporation

Aug 30, 2016 -

Indium Corporation Experts to Present at IEMT–EMAP 2016

Aug 09, 2016 -

Indium Corporation Receives ON Semiconductor Award for “Perfect Quality” in 2015

Aug 03, 2016 -

Indium Corporation’s State-of-the-Art Recycling Process Delivers Credit for Solder Pot Dross and Contaminated Solder

Apr 26, 2016 -

Indium Corporation VP of Technology to Host Webtorials May 17 & 19

Apr 22, 2016 -

Indium Corporation Announces Karch as Regional Technical Manager for Germany, Austria and Switzerland

Apr 21, 2016 -

Indium Corporation Expert Presents at SMTA ICSR 2016

Apr 12, 2016 -

Indium Corporation's New Indium10.2HF Solder Paste Delivers Superior ICT Performance

Apr 07, 2016 -

Indium Corporation’s Lasky to Present at Joint SMTA and IMAPS Meeting

Apr 06, 2016 -

Indium Corporation's Indium8.9HF Solder Paste Series Technology Solution to Avoid the Void™

Mar 29, 2016 -

Indium Corporation Names Hults as Global Accounts Manager

(241) more news from Indium Corporation

Indium10.1 Pb-Free Solder Paste Provides Lowest Voiding Levels for Large Ground Planes news release has been viewed 750 times

FPC* - Fluid Pressure Control - Dispensing Pump

Used PCB Equipment - ECM