SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Indium Corporation Technology Experts to Present at IMAPS New England

Indium Corporation Technology Experts to Present at IMAPS New England

Apr 18, 2014

Derrick Herron, Indium Corporation's technical support engineer.

Derrick Herron, Indium Corporation's technical support engineer.

Maria Durham, Indium Corporation's product specialist for semiconductor and advanced assembly materials.

Maria Durham, Indium Corporation's product specialist for semiconductor and advanced assembly materials.

Indium Corporation technology experts will serve as session chair and give a poster presentation at IMAPS New England May 6 in Boxborough, Mass.

Derrick Herron, technical support engineer, will give a poster presentation called Methods of Choosing a Solder Paste and Overcoming Common Challenges. His presentation will discuss what to consider when choosing a solder paste and how to prevent some of the common defects that may arise during manufacturing, such as head-in-pillow, graping, and QFN voiding.

Maria Durham, product specialist for semiconductor and advanced assembly materials, will serve as the session co-chair for the Technologies and Methods for 2.5D and 3D Packaging. She will be responsible for introducing speakers and facilitating the discussion.

Herron has worked with the world renowned Dr. Ning-Cheng Lee in Indium Corporation's research and development laboratory for more than five years. In addition, his work as a technician for Dr. Yan Liu focused on developments in solder paste and flux technologies. He has co-authored several research papers on the topic of QFN voiding. Herron has a bachelor’s degree in chemistry from Oklahoma State University in Stillwater, Oklahoma. He earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College and was certified in IPC-A-600 and IPC-A-610-D.

Durham serves as a technical liaison between Indium Corporation’s customers and internal departments, such as sales, technical support, research and development, and operations, to ensure the best quality and selection of products. Durham is a member of the International Microelectronics Assembly and Packaging Society and earned her bachelor’s degree in physics and applied mathematics from Clarkson University in Potsdam, N.Y. While she was at Clarkson, she worked as a McNair Scholar performing research in electro-chemical deposition.


Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.

Aug 30, 2016 -

Indium Corporation Experts to Present at IEMT–EMAP 2016

Aug 09, 2016 -

Indium Corporation Receives ON Semiconductor Award for “Perfect Quality” in 2015

Aug 03, 2016 -

Indium Corporation’s State-of-the-Art Recycling Process Delivers Credit for Solder Pot Dross and Contaminated Solder

Apr 26, 2016 -

Indium Corporation VP of Technology to Host Webtorials May 17 & 19

Apr 22, 2016 -

Indium Corporation Announces Karch as Regional Technical Manager for Germany, Austria and Switzerland

Apr 21, 2016 -

Indium Corporation Expert Presents at SMTA ICSR 2016

Apr 12, 2016 -

Indium Corporation's New Indium10.2HF Solder Paste Delivers Superior ICT Performance

Apr 07, 2016 -

Indium Corporation’s Lasky to Present at Joint SMTA and IMAPS Meeting

Apr 06, 2016 -

Indium Corporation's Indium8.9HF Solder Paste Series Technology Solution to Avoid the Void™

Mar 29, 2016 -

Indium Corporation Names Hults as Global Accounts Manager

240 more news from Indium Corporation »

Aug 23, 2017 -

Count On Tools Inc. Expands Panasonic Nozzles for AM100 Placement Equipment

Aug 23, 2017 -

Saelig Introduces Industrial Raspberry Pi Controller ComfilePi

Aug 23, 2017 -

Vi TECHNOLOGY Combines 3D Inspection with SIGMA Link for Smart Factories

Aug 23, 2017 -

Hanwha Techwin and ESE Partner to Bring Customers Value and Versatility

Aug 23, 2017 -

Laser Design CyberGage®360, Automated 3D Scanning & Inspection System Adopted by Proto Labs in Their State-of-the-Art Metrology Lab

Aug 23, 2017 -

ZESTRON to Feature HYDRON® Technology at SMTAI

Aug 23, 2017 -

The Hermes Standard: Viscom working on first field tests

Aug 19, 2017 -

See Latest Dispense Technology Demonstrations From GPD Global at NEPCON 2017

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

See electronics manufacturing industry news »

Indium Corporation Technology Experts to Present at IMAPS New England news release has been viewed 717 times

  • SMTnet
  • »
  • Industry News
  • »
  • Indium Corporation Technology Experts to Present at IMAPS New England
PCB Cleaning

FPC* - Fluid Pressure Control - Dispensing Pump