SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from MatriX Technologies GmbH


MatriX Technologies to Exhibit Advanced AXI Lineup at SMT/Hybrid/Packaging 2014

Apr 07, 2014

XT-3 High Resolution/High Magnification Traceable Automated X-ray Inspection System

XT-3 High Resolution/High Magnification Traceable Automated X-ray Inspection System

MatriX Technologies, a leading global supplier of advanced X-ray inspection systems for electronics assembly and industrial applications (AXI, MXI, CT and NDT), announces that it will exhibit in Booth #7-556 at SMT/Hybrid/Packaging, scheduled to take place May 6-8, 2014 in Nuremberg, Germany. Company representatives will demonstrate the XT-3, XT-6A and X3 inspection systems.

The XT-3 High Resolution/High Magnification Traceable Automated X-ray Inspection System utilizes the same MatriX Inspection Process Software (MIPS) as the XT-2. While the XT-3 is easily and quickly used in manual inspection mode it can also be used in a fully automated inspection process with the exception of "manually" loading and unloading the printed circuit assembly.

The XT-6 is a highly flexible X-ray inspection system featuring a parallel-kinematic Hexaglide manipulation unit that allows extreme off-axis X-ray transmission in the smallest of space with maximum speed and in high resolution. The XT-6A is setup as a manufacturing cell which allows fully automated loading, unload, and pass/fail sorting. The XT-6 will provide high mix OEM and EMS facilities with both production inspection and off-line failure analysis.

The patented Hexapod concept, with all 6 axes moving fully independently, guarantees precise motion including 3D AXI imaging for double-sided inspection.

The X3 In-Line 3D X-ray Inspection System combines two imaging technologies, high-speed, high resolution transmission (2D) and off-axis (2.5D) with two unique reconstruction techniques to address X-ray inspection of double-sided boards with high package densities. The X3 provides a flexible approach to inspecting solder joints on a double-sided board. The system is ideal for
high-speed double-sided inspection using the patented SFT™ technique to separate top and bottom solder joints. Additionally, the X3 provides a new approach for high-resolution multiple slice requests for BGAs and LGAs using the MatriX 3D-SART technology.


MatriX Technologies GmbH, founded in 2004 and headquartered in Munich/Feldkirchen (Germany), is a leading global supplier of high-speed Automated In-line X-Ray inspection systems (AXI for Electronics) and semi-automated/manual X-ray Inspection systems (MXI) that are used to control the manufacturing process and to ensure the quality of critical electronic devices/components and electronic printed circuit boards manufactured by its customers within series production. In addition, MatriX supplies manual, semi-automated and automated inspection solutions for non-destructive testing of other non-electronic materials, such as casting or medical parts, by using X-ray or computer tomography (CT) technology (AXI for NDT). MatriX’s inspection system solutions assist its global customer base to achieve and fulfill the highest quality demands for critical parts and components. As of 2013, MatriX Technologies employs a growing 80 staff in Germany, Hungary, China, Singapore, Japan and the US. For more information, stop by booth 7-556 at SMT Nuremberg, or visit www.m-xt.com.

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