SMT, PCB Electronics Industry News

Indium Corporation Features SACm™ at NEPCON China

Apr 03, 2014

SACm™ meets the electronics assembly market's demand for a solder paste that offers the combination of good drop test performance, good thermal cycling, lead-free composition, and reduced cost.

SACm™ meets the electronics assembly market's demand for a solder paste that offers the combination of good drop test performance, good thermal cycling, lead-free composition, and reduced cost.

Indium Corporation will feature SACm™ solder paste at NEPCON China April 23-24 in Shanghai, China.

SACm™ is a high-reliability, low-cost solder paste that offers drop test performance far superior to other SAC pastes without compromising on thermal cycling - all at a cost below that of typical SAC solder paste.

SACm™ meets the electronics assembly market’s demand for a solder paste that offers the combination of good drop test performance, good thermal cycling, lead-free composition, and reduced cost.

SACm™ offers superior drop test performance when compared to SAC305 and SAC105, with the added benefit of thermal cycling reliability that is equivalent to SAC305. SACm™ provides manufacturers with an affordable high-reliability SAC solder paste. This new alloy is especially meaningful for the manufacture of consumer electronics that normally see frequent handling, such as mobile devices.

SACm™ is doped with manganese and contains less silver than other Pb-free solder pastes. Manganese provides increased strength and the reduced silver content provides a more stable cost structure, which is especially beneficial for cost-sensitive applications.

Indium Corporation will be exhibiting at booth A2-1F29

For more information about Indium Corporation’s SACm™ solder paste, visit www.indium.com/SACm or email sacm@indium.com


Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

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