SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Association Connecting Electronics Industries (IPC)


VOLUNTEERS HONORED FOR CONTRIBUTIONS TO ELECTRONICS INDUSTRY AND IPC More than 150 awards presented at IPC APEX EXPO 2014

Mar 28, 2014

 IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at Mandalay Bay Convention Center in Las Vegas. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.

For his leadership of the 6-11 Printed Board Coplanarity Subcommittee that developed IPC-9641, High Temperature Printed Board Flatness Guideline, John Davignon, Davignon Consultancy, LLC, received a Committee Leadership Award. For their contributions to IPC-9641, Bev Christian, Ph.D., BlackBerry; Steven Ethride, Dell Inc.; Kayleen Helms, Intel Corporation; Rahul Joshi, Hewlett-Packard Company; and Tim Purdie, Akrometrix LLC, earned a Distinguished Committee Service Award.

For their leadership of the 2-30 Terms and Definitions Committee that developed IPC-T-50K, Mike Green; and Vicka White, Honeywell Inc. Air Transport Systems, earned a Committee Leadership Award. For their contributions to IPC-T-50K, Alisha Amar, Lockheed Martin Space Systems Company; Steven Bowles, Viasystems Group, Inc.; Matthew Byrne, BAE Systems Platform Solutions; Mahedra Gandhi, Northrop Grumman Aerospace Systems; Louis Hart, Compunetics Inc.; Joseph Kane, BAE Systems Platform Solutions; Karen McConnell, Northrop Grumman Corporation; Steven Nolan, Lockheed Martin Mission Systems & Training; and Paul Reid, earned a Distinguished Committee Service Award.

For her leadership of the 2-16 Product Data Description (Laminar View) Subcommittee that developed IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer, Karen McConnell, Northrop Grumman Corporation, earned a Distinguished Committee Service Award. For their contributions to IPC-2581B, Edward Acheson, Cadence Design Systems Inc.; Kjell Asp, Module Supply Center Kumla; Richard Attrill, Polar Instruments Inc.; Michael Buetow, UP Media Group, Inc.; Tony Calitri, Cisco Systems, Inc.; Gary Carter, Fujitsu Network Communications; Joseph Clark, DownStream Technologies, LLC; Larry Frost, Sanmina Corporation; Terry Hoffman, Cisco Systems; Humair Mandavia, Zuken USA, Inc.; John Milks, Adiva Corporation; William Newhard, DownStream Technologies, LLC; Hemant Shah, Cadence Design Systems Inc.; Chris Shaw, Fujitsu Network Communications; Karel Tavernier, Ucamco; Steve Watt, Zuken USA, Inc.; Iain Wilson, Iron Atom, Inc.; and Jamie Wise, WISE Software Solutions Inc., earned a Distinguished Committee Service Award.

For their leadership of the 5-24f Underfill Materials Design, Selection and Process Task Group that developed IPC J-STD-030A, Selection and Application of Board Level Underfill Materials, Brian Toleno, Ph.D., Henkel Corporation; Bill Vuono, TriQuint Semiconductor; and Fonda Wu, Raytheon Company, received Committee Leadership Awards. For their contributions to J-STD-030A, Raiyomand Aspandiar, Ph.D., Intel Corporation; Beverley Christian, Ph.D., BlackBerry; Laura Cohen, Ph.D., Continental Automotive Systems; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Nate Grinvalds, Rockwell Collins; Ife Hsu, Intel Corporation; Jason Keeping, Celestica; Jagadeesh Radhakrishnan, Intel Corporation; and Venmathy Rajarathinam, Intel Corporation, received a Distinguished Committee Service Award.

For their leadership of the A-620 Technical Training Task Group, Debbie Wade, Advanced Rework Technology-A.R.T and Gregg Owens, Space Exploration Technologies, earned a Committee Leadership Award. For their leadership of the A-620 Space Addendum Task Group, Garry McGuire, NASA Marshall Space Flight Center and Randy McNutt, earned a Committee Leadership Award. For their support of the A-620 space addendum and technical training task groups, Robert Cooke, NASA Johnson Space Center; Daniel Foster, Missile Defense Agency; Robert Humphrey, NASA Goddard Space Flight Center; Garry McGuire, NASA Marshall Space Flight Center; Richard Rumas, Honeywell Canada; Patricia Scott, STI Electronics, Inc.; and Jonathon Vermillion, Ball Aerospace & Technologies Corp., were recognized with a Special Recognition Award. For their efforts in A-620 training development, the A-620 space addendum, or in many cases both, James Blanche, NASA Marshall Space Flight Center; Dorothy Cornell, Blackfox Training Institute; Robert Fornefeld, L-3 Communications; Matt Garrett, Phonon Corporation; Shelley Holt, L-3 Communications; Kathy Johnston, Raytheon Missile Systems; Sean Keating, Amphenol Limited (UK); Agnieszka Ozaworski, BAE Systems; Helena Pasquito, EPTAC Corporation; Pamela Petcosky, Lockheed Martin Mission Systems & Training; Gregory Rohrbacher, Raytheon Missile Systems; and Zenaida Valianu, Celestica, earned a Distinguished Committee Service Award.

For his leadership of the IPC Government Relations Steering Committee, Mikel Williams, JPS Industries, Inc., earned a Committee Leadership Award.

For their service to the IPC APEX EXPO 2014 Technical Program Committee, Eric Bastow, Steve Butkovich, Beverley Christian, Ph.D., BlackBerry; Gary Ferrari, FTG Circuits; Denny Fritz, MacDermid, Inc.; Patty Goldman, P. J. Goldman Consulting; Dave Hoover, TTM Technologies; Wayne Johnson, Ph.D., Tennessee Tech University; Russ Nowland, Alcatel-Lucent; and Alan Rae, Ph.D., Nanomaterials Innovation Center, received Distinguished Committee Service Awards. For his significant contributions to the IPC APEX EXPO 2014 Technical Program Committee, Jeff Schake, DEK International, earned a Special Recognition Award.

For his leadership of the Executive Market and Technology Steering Committee, Don Schroeder, Paradigm Shift Development, earned a Committee Leadership Award.

For their leadership of 7-31j Requirements for Structural Enclosure Task Group that developed IPC-HDBK-630, Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures, E. Eddie Hofer, Rockwell Collins and Richard Rumas, Honeywell Canada, earned a Distinguished Committee Service Award. For their contributions to IPC-HDBK-630, Alisha Amar, Lockheed Martin Space Systems Company; Bruce Badger, GE Healthcare; Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.; Gary Ferrari, FTG Circuits; Joseph Kane, BAE Systems Platform Solutions; Sean Keating, Amphenol Limited (UK); Gregg Owens, Space Exploration Technologies; Douglas Schueller, AbelConn, LLC; and Michael Zampini, Honeywell Canada, earned a Distinguished Committee Service Award.

For her leadership in printed electronics and guidance in creating educational outreach offerings to maximize value to the technology student and educator, Margaret Joyce, Ph.D., Western Michigan University, earned a Special Recognition Award.

For his leadership of the 2-18j Lab Report Declaration Task Group that developed IPC-1753, Laboratory Declaration Standard, William Haas, Seagate Technology LLC, earned a Distinguished Committee Service Award. For their contributions to IPC-1753, Gerald Bagnowski, Environmental Monitoring & Technologies Inc.; Vivienne Boogaard, Intel Corporation; Forrest Christian, Innovation Machine Ltd.; Jim Cronin, Environmental Monitoring & Technologies Inc.; Nicole Effenberger, SGS Consumer Testing Services; Mark Frimann, Texas Instruments Inc.; Walter Jager, ECD Technology Ltd.; Kurk Kan, Murata Power Solutions, Inc.; Marcus Khoo, Altera Corporation; John Kuta, PTC; N. Nagaraj, Ph,D., Papros, Inc.; John Sharp, TriQuint Semiconductor Inc.; Aidan Turnbull, Ph.D., ENVIRON UK Ltd; Lee Wilmot, TTM Technologies, Inc.; Kaiwen Yao, ALS Technichem (S) Pte. Ltd.; and Linda Young, Intel Corporation, and earned a Distinguished Committee Service Award.

For his leadership in promoting IPC standards and training in the Korean electronics industry, Yoon Hak Hyun, I-SAC Electronic Co. Ltd., earned a Special Recognition Award.

For his leadership of the 2-1h Conflict Minerals Task Group that developed IPC-1755, Conflict Minerals Data Exchange Standard, John Plyler, BlackBerry, received a Committee Leadership Award.

For their contributions to IPC-1755, Japan Electronics and Information Technology Industries Association (JEITA), Goran Andersson, Ericsson AB; Michiko Arikawa, Panasonic; Brenda Baney, Delphi Electronics and Safety; David Bender, TE Connectivity; David Carnevale, Dolby Laboratories; Forrest Christian, BlackBerry; Jared Connors, Intel Corporation; Amanda Davidson, Freescale Semiconductor, Inc.; Mark Frimann, Texas Instruments Inc.; Kazuya Fijiwara, Toshiba Corporation; William Haas, Seagate Technology LLC; Hidetatsu Hanzawa, Yokogawa Electric Corporation; Richard Horvath, Visteon Hungary Ltd.; Kazuyuki Ikeda, HITACHI; Hajime Iwata, Panasonic Corporation; Wilhelm Janisch, Motorola Mobility, Inc.; Nikki Johnson, Total Parts Plus, Inc.; Kurk Kan, Murata Power Solutions, Inc.; Marcus Khoo, Altera Corporation; Hiroshi Kobayashi, TDK; Kenneth Manchen, Premier Farnell Corp.; N. Nagaraj, Ph.D., Papros, Inc.; Johji Nakamura, Fujitsu Limited; David Pinsky, Raytheon Company; Tomoko Sasaki, Toshiba Corporation; Hirotaka Satou, NEC Electronics Co.; Andreas Schiffleitner, Kerp Center of Excellence Electronics & Environment; Achim Schrempp, iPoint-Systems GmbH; John Sharp, TriQuint Semiconductor Inc.; Atsumi Shinobu, Nikon Corp Technology Research Planning; Aimee Siegler, Benchmark Electronics Inc.; Sheldon Tolchinksy, Nielson; Yasunao Takahashi, Elpida Memory, Inc.; Joerg Walden, iPoint-Systems GmbH; Lee Wilmot, TTM Technologies, Inc.; Timothy Wodrich, John Deere Electronic Solutions, Inc.; Michael Wolf, Chrysler Group LLC; and Akimasa Yamakawa, Murata Manufacturing Co. Ltd., received a Distinguished Committee Service Award.

For his outstanding contributions to system technology educational outreach, Senol Pekin, Intel Corporation, received a Special Recognition Award.

For their leadership of the 6-10d SMT Attachment Reliability Test Methods Task Group that developed IPC-9709, Test Guidelines for Acoustic Emission Measurement during Mechanical Testing, Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory; Vasu Vasudevan, Intel Corporation; and Gnyan Ramakrishna, Cisco Systems Inc., earned a Committee Leadership Award. For their contributions to IPC-9709, Elizabeth Benedetto, Hewlett-Packard Company; Beverley Christian, Ph.D., BlackBerry; Jeffrey Lee, Integrated Service Technology – ISTi; Ron Miller, Ph.D., Mistras Group Inc.; and Julie Silk, Agilent Technologies, earned a Distinguished Committee Service Award.

For their leadership of the 6-10d SMT Attachment Reliability Test Methods Task Group that developed IPC-9706, Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection, Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory; Ramagopal Uppalapati, Intel Corporation; and Vasu Vasudevan, Intel Corporation, earned a Committee Leadership Award. For their contributions to IPC-9706, Aileen Allen, Hewlett-Packard Company; Nicole Butel, Avago Technologies; and Ife Hsu, Intel Corporation, earned a Distinguished Committee Service Award.

For more information on these awards or the award recipients, contact Anna Garrido, IPC marketing and communications director, at +1 847-597-2804.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,400 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

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