SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Nordson DAGE


Nordson DAGE Accepts a 2014 NPI Award for Camera Assist Automatic Bondtesting at APEX Advanced technology guarantees accuracy and repeatability

Mar 26, 2014

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it has been awarded a 2014 NPI (New Product Introduction) Award in the category of Test and Inspection – Functional Test for its Camera Assist Automatic Bondtesting. The award was presented to the company by Circuits Assembly Editor-in-Chief Mike Buetow during a Tuesday, March 25, 2015 ceremony that took place at the Mandalay Bay Convention Center during the IPC APEX EXPO.

Based upon a pedigree of automatic bond testing technology spanning more than two decades, Nordson DAGE has developed the latest camera assist automation as a feature of the award winning 4000Plus bondtester platform.  Built around a unique multi-function cartridge, the camera assist automation system is ideally suited for applications such as pull and shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages.  Easy programming using fiducial camera assist and vector stage nudge buttons provides precise X-Y alignment and facilitates rapid changeover for a variety of bond testing applications.

Nordson DAGE President, Phil Vere commented “Nordson DAGE is very pleased to be recognized with this award. The release of this automation capability on the 4000Plus is a significant milestone which will offer our customers real tangible benefits in terms of running costs and performance.”

Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

For more information about Nordson DAGE, visit www.nordsondage.com.


Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries.  For more information, visit www.nordsondage.com.


Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service.  Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing.  Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries.  Visit Nordson on the web at www.nordson.com, www.twitter.com/Nordson_Corp  or www.facebook.com/nordson.

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