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Koh Young Unveils Advanced 3D Measurement, Process Solutions at APEX 2014

Mar 19, 2014

Koh Young America and Koh Young Technology (Seoul, Korea) will demonstrate exciting new breakthroughs in PCB inspection at IPC/APEX 2014 in Las Vegas, Nevada this coming week. New KSMART Remote Control, the most advanced process control and optimization system will join new Foreign Material Inspection capability and KSMART Warp, a unique tool for compensating for PCB warp during the 3D Solder Paste Inspection (SPI) process. These new developments, including the full range of patented 3D measurement solutions from Koh Young, will be exhibited in Booth #662 in the convention hall at the Mandalay Bay resort and convention center.

KSMART Remote Control helps customers achieve the most effective process management for flexible manufacturing. With the KSMART system, machine status, yield information, and real time defect information from all Koh Young SPI and AOI machines in multiple production lines can be directly communicated to and operated by the KSMART Remote Control System. With KSMART, a factory manager can monitor defects, analyze root causes, and apply changes to inspection programs in real time through the KSMART Remote Control System. Real time defect information is also shared with remote operators, while saved changes to the inspection program are shared with the operators’ individual PCs in real time. With KSMART, operators can review detailed defect reports and information and even effect solutions, all from remote locations. Stable and quick remote process monitoring is enabled via the local network. The KSMART Remote Control System, including multi-line monitoring and control, will be demonstrated live in the booth by connecting two (2) 3D AOI systems and two (2) 3D SPI systems.

Defects caused by foreign material contamination, e.g., hair, dust, etc. can occur during production, and are often incorrectly identified as process defects, since they are typically very small in size. Koh Young’s new Foreign Material Inspection functionality helps operators identify such defects, since they are not related to the printing process, without having to visually inspect production boards. Remote operators also can check foreign material defects via KSMART Remote Control System. Koh Young Foreign Material Inspection will be demonstrated on 3D SPI systems at the booth.

The KSMART Warp functionality for 3D SPI systems now applies to a wider range of applications, from large dimension boards to flexible PCBs and small arrayed boards. KSMART Warp automatically compensates for PCB warp in real time during inspection, using CAD information or learned PCB geometry prior to inspection. KSMART Warp will be demonstrated in the booth with 3D SPI systems.

Koh Young will demonstrate full 3D Measurement-based inspection solutions for SMT assembly, including 3D SPI with aSPIre 2 and KY8030-3 SPI systems. Koh Young will also demonstrate pre- and post-reflow 3D AOI with two Zenith systems. Koh Young’s true 3D measurement systems provide full patented 3D measurement for the complete range of applications, materials, and components in SMT PCB assembly. Koh Young Technology's patented Multi-frequency Moiré Technology with multi-projection 3D inspection probes enable a wide measurement range, up to 2mm, while ensuring accurate 3D inspection without sacrificing resolution.


Koh Young Technology specializes in the design and manufacturing of 3D measurement and inspection equipment for the global circuit board assembly and semiconductor markets. Direct sales and support centers are located in the United States, Europe, Japan, Singapore, China (Shenzhen) and Korea.

For more information about the company, visit www.kohyoung.com. Koh Young America Inc.; 6150 W. CHANDLER BLVD SUITE #39, CHANDLER, AZ 85226; Tel : +1-480-403-5000; Fax : +1-480-403-5001; E-mail: america@kohyoung.com
 

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