The 19th Annual Pan Pacific Microelectronics Symposium that took place February 11-13, 2014, at the Hapuna Beach Prince Resort on the Big Island of Hawaii was well received by attendees from North America, Asia, and Europe. Over fifty papers were presented to attendees from seventeen countries. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.
As rated by the attendees, the Best Presentation Award went to Kyung W. Paik, Ph.D., KAIST, for his paper titled, “Novel Nanofiber Anisotropic Films (ACFS) for Fine Pitch Assembly.”
Technical papers from all sessions are featured in the 2014 Pan Pacific Symposium Proceedings available in the SMTA Bookstore.
“2015 will mark the 20th anniversary of the Pan Pacific Microelectronics Symposium, one of the longest running events sponsored by the SMTA,” noted steering committee chair Charles E. Bauer, Ph.D., TechLead Corporation. “Come join the celebration and network with world leaders from throughout the electronics packaging, interconnect and assembly industry.”
Next year the symposium will be held February 3-5, 2015 at the Sheraton Poipou Resort in Kauai, Hawaii. Abstracts can be submitted online at www.smta.org/panpac/call_for_papers.cfm. For more information on the Pan Pacific Microelectronics Symposium, contact SMTA administrator JoAnn Stromberg at 952-920-7682 or email@example.com.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.