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News from Association Connecting Electronics Industries (IPC)


INAUGURAL IPC TECHSUMMIT COMBINES THREE IPC CONFERENCES INTO ONE Focus on Innovation, Reliability and Leadership

Feb 27, 2014

Combining three events into one, IPC’s inaugural IPC TechSummit™ on October 28–30, 2014, in Raleigh, N.C., will focus on innovation, reliability and leadership — three cornerstones of successful business in today’s electronics marketplace. The summit, targeting electronics industry engineers, technologists, managers and executives, will provide world-class educational and networking opportunities as well as panel discussions to help participants identify solutions to common and not-so-common technology, process and business challenges.

As a member-driven, member-focused organization, IPC acted on member requests to co-locate several important events in order to help them save on expenses and time out of the office,” said Sanjay Huprikar, IPC vice president of member success. “Over the course of three days, three unique conferences will provide attendees with information on the latest advances in technology and business practices.”

The Electronic System Technologies Conference, an event launched in 2013, will feature presentations on innovative solutions.

Covering foundry and components to board assemblies and complete systems, this conference will touch on all phases of product development, and will engage experts and the industry in meaningful dialogue to take a holistic approach in identifying and addressing system challenges.

Another highly popular event, the Tin Whiskers Conference, will focus on reliability. Produced in conjunction with CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland, this conference will tap into the expertise of a diverse list of industry’s elite, including academia and research professionals, who will guide participants through the full-range of tin whiskers theory and practice, and identify solutions to reliability challenges found in aerospace, automotive, telecom, medical and other critical vertical markets.

IPC TechSummit’s Leadership Conference will host a series of four, half-day modules, where subject-matter experts and consultants will delve into the latest developments in conflict minerals compliance, environmental regulations, supply chain risk mitigation and on-shoring strategies.

Attendees will convene on day three for keynote addresses, panel discussions and sessions led by prominent chief technical officers and research and development leaders in the electronics industry.

IPC is privileged to collaborate again with two industry heavyweights, Dr. Senol Pekin from Intel who chaired the 2013 Electronic System Technologies Conference, and Dr. Michael Osterman from the University of Maryland, CALCE, who chaired the successful 7th Annual Symposium on Tin Whiskers,” added Huprikar. “This one-of-a-kind event will provide robust technical content, significant networking opportunities and tools that attendees need to prepare for the ever-changing landscape in electronics.”

Exhibitions and sponsorship opportunities are available. For more information, contact Maria Labriola, at MariaLabriola@ipc.org or +1 847-597-2866.

For more information on IPC TechSummit, visit www.ipc.org/TechSummit. To sign up for event updates, visit www.ipc.org/event-updates.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,400 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

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