SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • ADLINK Launches first Certified Intel® Industrial Solutions System Consolidation Platform

ADLINK Launches first Certified Intel® Industrial Solutions System Consolidation Platform

Feb 26, 2014

ADLINK Technology Inc., a global provider of embedded building blocks and Application Ready Intelligent Platforms (ARIPs), today announced its Matrix MXE-5301 fanless, embedded computer as the first hardware platform to be certified for the Intel® Industrial Solutions System Consolidation series. The ADLINK MXE-5301 supports a wide temperature range and offers a fanless and cable-free design, making it uniquely suited for industrial applications. Intel’s industrial workload consolidation platform with the MXE-5301 enables the combination of several applications or workloads and their respective host operating systems into a single computing solution. What were once multiple, separate systems can now be combined into just one platform using advanced hypervisor technology that allows host operating systems to coexist. For the customer, workload consolidation reduces the number of individual devices, allowing a single, smaller footprint and lowered system and environmental complexity.

ADLINK has a long history in industrial automation design. It’s exciting to be able to showcase modern software tools and demonstrate how the market will benefit,” said Roy Wan, GM, Measurement and Automation at ADLINK Technology. “We look forward to continuing our work with Intel on this leading effort to build industry-specific application ready platforms.”

Increasing reliability and reducing complexity on the factory floor are critical needs for industrial automation,” explained Jim Robinson, general manager Segments and Broad Market, Internet of Things Solutions Group at Intel. “Consolidating heterogeneous workloads using hypervisor technology relies on a capable and reliable hardware foundation. The collaboration with ADLINK allows us to introduce deployment-ready platforms that can handle those computing challenges.”

In addition to the current collaboration on the workload consolidation program, ADLINK is also proud to announce its promotion by Intel to Premier Member in the Intel® Intelligent Systems Alliance. From modular components to market-ready systems, Intel and the 250+ global member companies of the Alliance provide the performance, connectivity, manageability, and security developers need to create smart, connected systems. Close collaboration with Intel and each other enables Alliance members to innovate with the latest technologies, helping developers deliver first-in-market solutions. "It's a great honor for ADLINK to achieve the Premier level through more than a decade of successful cooperation with Intel. We have demonstrated successful global business growth strategies and have led the market with vertical applications based on Intel® embedded architecture,” said Jim Liu, CEO of ADLINK Technology, Inc. “This level of alliance gives us more and better opportunities to collaborate with Intel on new and emerging technologies, and better serve our customers and partners with advanced platforms."

Intel is a registered trademark of Intel Corporation in the United States and other countries.


ADLINK Technology provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries. ADLINK products include PCI Express-based data acquisition and I/O; vision and motion control; and AdvancedTCA, CompactPCI, and computer-on-modules (COMs) for industrial computing. With the acquisition of Ampro Computers, Inc. and LiPPERT Embedded Computers GmbH, ADLINK also provides a wide range of rugged by design Extreme Rugged™ and Rugged product lines including single board computers, COMs and systems. 

ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, the US, and Germany; and an extensive network of worldwide sales and support offices.

ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified, is an Associate Member of the Intel® Intelligent System Alliance, an Executive Member of PICMG, a Sponsor Member of the PXI Systems Alliance, an Executive Member of PC/104 Consortium, a Strategic Member of the AXIe Consortium, and a member of VMEbus International Trade Association (VITA). ADLINK is a publicly traded company listed on the TAIEX Taiwan Stock Exchange (stock code: 6166).

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ADLINK Technology Showcasing Latest Rugged Embedded Railway Solutions at Major European Railway Exhibitions TRAKO, Expo Ferroviaria and Nordic Rail

Sep 07, 2017 -

ADLINK Introduces High-Performance Combination of PCI/104-Express Type 1 (PCIe x16) Stackable Bus Structure and 6th Gen Intel® CoreTM Processors in Latest Single Board Computer

Sep 07, 2017 -

ADLINK Technology Invites To Join New-Tech's IOT Embedded & Microprocessors 2017

Aug 16, 2017 -

ADLINK Introduces MVP-6010/6020 Series of Expandable Fanless Embedded Computers with Four Expansion Slots

May 22, 2017 -

ADLINK Open Compute Project Specification Approved for Carrier Grade CG-OpenRack-19

Apr 10, 2017 -

ADLINK Launches cPCI-6630 6U CompactPCI® Processor Blade with 6th Generation Intel® Core™ i7 Processor

Mar 09, 2017 -

ADLINK Introduces Ready-to-Go Smart Camera with MVTec MERLIC

Mar 01, 2017 -

ADLINK Technology Highlights COM, Cloud and Computing Technology for the Industrial Internet of Things at Embedded World 2017

Feb 01, 2017 -

An Invitation to ICE Totally gaming Exhibition 2017 in London, Booth N1-224

91 more news from ADLINK Technology, Inc. »

Dec 14, 2017 -

Ersa to Hold Versaflow 3 Maintenance Training Course in Mexico

Dec 12, 2017 -

ECT’s Switch Probes: Cost-Efficient Solutions for Testing Electronic Assemblies

Dec 12, 2017 -

NEO Tech Design Team Wins Industry Award for Creative Solutions that Accelerate Time-to-Market

Dec 12, 2017 -

STI Has Accomplished AS9100D Certification

Dec 07, 2017 -

Nordson ASYMTEK Receives 2017 Global Technology Award for the NexJet NJ-8 Jetting System with ReadiSet 2-piece Jet Cartridge Award presented at Productronica 2017

Dec 07, 2017 -

Banner Engineering Completes Implementation of Optel Software on ASM Lines in Minneapolis and Suzhou (China)

Dec 06, 2017 -

Pan Pacific Microelectronics Symposium Program Finalized

Dec 05, 2017 -

Scienscope Promotes Don Jeka to National Sales & Marketing Manager for Its X-ray Division

Dec 05, 2017 -

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Dec 05, 2017 -

Indium Corporation’s Vareha-Walsh to Present at International Electronic Recycling Congress (IERC) 2018

See electronics manufacturing industry news »

ADLINK Launches first Certified Intel® Industrial Solutions System Consolidation Platform news release has been viewed 741 times

  • SMTnet
  • »
  • Industry News
  • »
  • ADLINK Launches first Certified Intel® Industrial Solutions System Consolidation Platform
HeatShield Gel- thermal PCB shield during reflow

FPC* - Fluid Pressure Control - Dispensing Pump