MatriX-FocalSpot, a leading global supplier of advanced X-ray inspection systems for electronics assembly and industrial applications (AXI, MXI, CT and NDT), with parent company MatriX Technologies, announces that it will exhibit in Booth #348 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada. Company representatives will demonstrate the XT-2, XT-3, XT-6A and X3 inspection systems.
The XT-2 High Resolution/High Magnification Traceable Manual X-ray Inspection System ushers in a new approach to the more traditional Manual X-ray Imaging (MXI) use model. Designed for ease of use and the quickest solder quality feedback, the XT-2 utilizes a more advanced automated software platform called MatriX Inspection Process Software (MIPS). With this software, the XT-2 can achieve full inspection traceability using bar code or manual product data input, automated image archival and results reporting.
The XT-3 High Resolution/High Magnification Traceable Automated X-ray Inspection System utilizes the same MatriX Inspection Process Software (MIPS) as the XT-2. While the XT-3 is easily and quickly used in manual inspection mode it can also be used in a fully automated inspection process with the exception of "manually" loading and unloading the printed circuit assembly.
The XT-6A Fully Automated X-ray Inspection System with Off-Line Conveyor is highly flexible, featuring a parallel-kinematic Hexaglide manipulation unit that allows extreme off-axis (2.5D) X-ray transmission in the smallest of space with maximum speed and in high resolution. This technology is especially suitable for high-quality X-ray analysis of electronic assemblies as well as material analysis of parts, where flexible part manipulation with multiple inspection angles is needed. The patented Hexapod concept with all 6-axes moving fully independently guarantees precise motion including Planar CT imaging performance. The XT-6A also boasts automatic load/unload setup.
The X3 In-Line 3D X-ray Inspection System combines two imaging technologies, high-speed, high resolution transmission (2D) and off-axis (2.5D) with two unique reconstruction techniques to address X-ray inspection of double-sided boards with high package densities. The X3 provides a flexible approach to inspecting solder joints on a double-sided board. The system is ideal for
high-speed double-sided inspection using the patented SFT™ technique to separate top and bottom solder joints. Additionally, the X3 provides a new approach for high-resolution multiple slice requests for BGAs and LGAs using the MatriX 3D-SART technology.
For more information, visit www.matrix-focalspot.com.
MatriX Technologies GmbH, founded in 2004 and headquartered in Munich/Feldkirchen (Germany), is a leading global supplier of high-speed Automated In-line X-Ray inspection systems (AXI for Electronics) and semi-automated/manual X-ray Inspection systems (MXI) that are used to control the manufacturing process and to ensure the quality of critical electronic devices/components and electronic printed circuit boards manufactured by its customers within series production. In addition, MatriX supplies manual, semi-automated and automated inspection solutions for non-destructive testing of other non-electronic materials, such as casting or medical parts, by using X-ray or computer tomography (CT) technology (AXI for NDT). MatriX’s inspection system solutions assist its global customer base to achieve and fulfill the highest quality demands for critical parts and components. As of 2013, MatriX Technologies employs a growing 80 staff in Germany, Hungary, China, Singapore, Japan and the US. More information about the company can be found on www.m-xt.com.
MatriX-FocalSpot, Inc. is MatriX Technologies’ US based subsidiary and supplier of high quality manual and semi-automated x-ray inspection systems.