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SMTA S.E. Asia Technical Conference Program Finalized

Feb 11, 2014

SMTA is very excited to announce the three-day South East Asia Technical Conference on Electronics Assembly Technologies, to be held April 8-10, 2014 at the Eastin Hotel in Penang, Malaysia. 

Conference Chair Mei Ming Khaw, Agilent, has assembled a highly technical program that will be very informative for attendees of various backgrounds. Conference sessions will cover Sustainable Lead Free Manufacturing, Solder Paste Reliability, Emerging Technologies, Cleaning, Miniaturization, QFN Reliability, and Latest Advances in High Density Interconnect.

Companies participating in the program include Agilent Technologies, Cisco Systems Ltd., Flextronics, IBM Corporation, Indium Corporation, Intel Corporation, Jabil Circuit, Kester, Motorola Solutions, and Texas Instruments.

Training workshops will be held on Tuesday, April 8. Workshop topics will be Electromigration, 3D PoP for the SMT World, Achieving High Reliability of Lead-Free Soldering, and Cleaning and Contamination Process Guide.

Event website:

Special thanks goes to the technical committee for putting together this outstanding program.  The committee consists of Conference Chair Mei Ming Khaw, Agilent; Ning-Cheng Lee, Indium Corporation; KL Lim, Plexus; Lian-Huat Ng, Plexus; Teng Hoon Ng, Celestica, Inc.; Jonas Sjoberg, Flextronics; AK Tan, Robert Bosch Sdn Bhd; and David Vetharudge, Listech Technology.

The SE Asia Technical Conference on Electronics Assembly Technology is sponsored by the SMTA with support from the Persatuan Surface Mount Technology P. Pinang.

Contact Patti Coles,, with questions or comments.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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