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Preview for the Military Aviation Exhibition, Avenue Convention Center, Airport City, Tel Aviv

Jan 29, 2014

The Pilot4DV8 is especially equipped with tools dedicated to the complex task of repair on a depot environment, featuring passive and active in-circuit test, combined with proprietary tools to detect stuck-at faults without any component information, visual test, thermal test and, for new technologies, on-board programming and boundary scan capabilities.

The Pilot4DV8 is especially equipped with tools dedicated to the complex task of repair on a depot environment, featuring passive and active in-circuit test, combined with proprietary tools to detect stuck-at faults without any component information, visual test, thermal test and, for new technologies, on-board programming and boundary scan capabilities.

Depot Test Solutions by Seica SpA

"Depot Test Solutions to bridge the heritage of the past with the needs of the future". Seica's first participation to this exhibition is focused to offer solutions to assure long-term maintenance of electronic equipments, a strong requirement across the life cycle of defense products .

The first solution looks at customer’s  needs from the past and provides a comprehensive set of tools and a rigorous process to rebuild, through Reverse Engineering, the CAD data required for test generation, schematics and board layout documents for engineering or to assemble new boards, clone of the original, starting from a reference board. Test generation and long-term maintenance for old, obsolete products, becomes now easily feasible. The Reverse Engineering process is performed with the Pilot4DV8 flying prober, the latest member of the Pilot family that provides, via dual access with four probes on each side, the most performing test solution.

The Pilot4DV8 is especially equipped with tools dedicated to the complex task of repair on a depot environment, featuring passive and active in-circuit test, combined with proprietary tools to detect stuck-at faults without any component information, visual test, thermal test and, for new technologies, on-board programming and boundary scan capabilities. Pilot4DV8 is the most cost-effective solution on a depot environment to test, diagnose, locate and repair electronic boards either starting from CAD data or regenerating them via Reverse Engineering. For final test certification, Seica’s offer is provided by the ValidATE line of functional ATE. Bridging past requirements with today technological needs, ValidATE combines old traditional tools like analog/digital guided probe or post-processing from commercial simulators like LASAR, with state-of-the-art architecture including 25MHz on-the-fly pattern rate, parallel active analog test, serial bus and boundary scan performances and more.

To address the issue of Legacy Replacement of old ATE, ValidATE includes a large offer of TPS translators for Teradyne, GenRad and Schlumberger functional ATE. The combination of these solutions will allow depot operations to provide a comprehensive and effective answer to cover the backlog of old boards to be repaired, the replacement of obsolete test equipments, the assurance for long term maintenance and the test capability to deal with today and tomorrow new technologies.

Sep 18, 2017 -

Seica Inc. participation at SMTAi Schaumburg, Illinois Booth # 315 New Frontiers of Testing -

Jul 10, 2017 -

Preview for Seica Inc for Semicon West – Semicon West – 7/11/17 – 7/13/17 – San Francisco, CA – Booth #7709 

May 05, 2017 -

Preview for Seica SMT Nuremberg May 16-18, 2017 Booth # 4A-300. In the limelight: Industrial Monitoring and Automation

Apr 19, 2017 -

Seica SpA to participate at Electron TechExpo, Moscow, Russia, April 25 – 27 2017, Booth B-511

Feb 20, 2017 -

Gala dinner event in Castello of Pavone, Turin, Italy marks 30 years in business for the ATE manufacturer

Feb 14, 2017 -

Preview for Seica for IPC Apex 2017, San Diego -- Booth 1933 - Expanded Lines of Test and Assembly Equipment

Feb 08, 2017 -

Press preview for Seica Inc. participation at Apex 14 – 16 February 2017, San Diego, CA, Booth 1933

Jan 04, 2017 -

Seica To Set Up a New Competence Center in Karlsruhe, Germany

Oct 02, 2016 -

Press preview for Seica SpA participation at Electronica, Munich, November 8 – 11, 2016, Hall A1, Booth A1-459, New Munich Trade fair.

Sep 27, 2016 -

Preview for Seica SpA participation at Electronica, Munich.

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Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

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MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

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