SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • The SMTA Capital Chapter to Host First Meeting of the Year on March 4th at Johns Hopkins Applied Physics Lab

The SMTA Capital Chapter to Host First Meeting of the Year on March 4th at Johns Hopkins Applied Physics Lab

Jan 29, 2014

 Dr. Zhiyong Gu

The SMTA Capital Chapter is pleased to announce its first meeting of 2014 on March 4th, from 5:30 pm until 8 pm at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723. The focus of this chapter meeting will be “Development of Lead-free Nanosolders for Micro/Nanoelectronics Assembly and Packaging” presented by Dr. Zhiyong Gu, Associate Professor, Department of Chemical Engineering and Nanomanufacturing Center, University of Massachusetts Lowell.

Nanosolders have shown great promise in enabling smaller scale assembly and packaging, such as nanoelectronics assembly and nanodevice integration. In this presentation, Dr. Gu will review the recent progress on nanosolder research and nanosoldering development, including nanosolder synthesis and characterization, melting temperature depression, nanowire soldering and interconnection. He will also show his recent results on lead-free nanosolder paste, nanosolder reflow, and nanowire assembly and soldering, and discuss some important issues such as wetting, intermetallic formation, and nanosolder joint reliability.

Dr. Gu is currently an Associate Professor and Graduate Coordinator in the Chemical Engineering Department at the University of Massachusetts Lowell, where he is also affiliated with the Nanomanufacturing Center. He received his Ph.D. from the University at Buffalo, the State University of New York in 2004 and worked as a Postdoctoral Fellow at the Johns Hopkins University from 2004 to 2006. His research interests include nanoparticles and nanowires, self-assembly, sensors and biosensors, and nanoscale assembly and integration for electronics and devices. He has published 4 book chapters and over 50 peer-reviewed journal papers, and contributed to over 130 presentations in professional conferences. He is currently an Associate Editor for the Journal of Nanoparticle Research and serves on the editorial board of several other journals.

The evening is scheduled as follows:

5:30-6:30 pm Registration, Networking and Dinner
6:30-7:30 pm Presentation: “Development of Lead-free Nanosolders for Micro/Nanoelectronics Assembly and Packaging” presented by Dr. Zhiyong Gu
7:30-8:00 pm Q & A

Location:
Johns Hopkins Applied Physics Lab
11100 Johns Hopkins Road
Laurel, MD 20723
(240) 228-5000

Please join us for this networking, learning and dinner event. The registration fees are $20 for members and $30 for non-members.  Any new member that joins the chapter at this event can attend the next chapter meeting for FREE.

To RSVP, please click on the following link http://www.smta.org/chapters/rsvp.cfm?BEE_ID=3283&BULK_EMAIL_NO=1.


The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

For more information or to join, please visit www.smta.org.

May 13, 2018 -

SMTA/CALCE Announce Program for Symposium on Counterfeit Parts and Materials

May 06, 2018 -

SMTA Capital Chapter to Host Chapter Meeting

Apr 24, 2018 -

iNEMI Co-Hosts Automotive Session at SMTA Europe’s Electronics in Harsh Environments Conference

Apr 22, 2018 -

SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab

Apr 18, 2018 -

SMTA Europe's Harsh Environments Conference Session 6 to Focus on Automotive Electronics

Apr 17, 2018 -

International Conference for Electronics Enabling Technologies (ICEET) Program Finalized

Apr 16, 2018 -

Session 5 to Focus on Adhesives/Coatings at SMTA Harsh Environments Conference

Apr 15, 2018 -

Electrochemical Reliability Is the Focus of Session 4 at SMTA Europe's Harsh Environments

Apr 11, 2018 -

SMTA Europe's Harsh Environments Conference Session 3 to Focus on Advanced Test

Apr 09, 2018 -

Session 2 of SMTA Europe's Harsh Environments Conference to Focus on Reliability

598 more news from Surface Mount Technology Association (SMTA) »

May 18, 2018 -

YINCAE’S SMT 158A Receives High Praise

May 18, 2018 -

Solderstar to Exhibit at SMTA Michigan Expo & Tech Forum

May 16, 2018 -

SHENMAO America to Show New Solder Alloy with High Thermal & Impact Reliability at SMTA Michigan Expo

May 16, 2018 -

Thermaltronics Debuts TMT-ST10 Versatile 3-in-1 Soldering Tip Tester

May 16, 2018 -

ACL Introduces ESD-Safe Finger Cots

May 16, 2018 -

ACL Introduces PL40 Premium Penetrating Lubricant

May 15, 2018 -

ZESTRON to Exhibit at SMTA Michigan Expo and Tech Forum

May 15, 2018 -

Creative Electron to Kick Off New Webinar Series with, “Everything You Need to Know About X-Ray”

May 15, 2018 -

Electronics Industry Executives Meet in DC to Urge Action on Pro-Manufacturing Policies

May 15, 2018 -

EVS to Showcase the EVS500LF at SMT/Hybrid/Packaging 2018

See electronics manufacturing industry news »

The SMTA Capital Chapter to Host First Meeting of the Year on March 4th at Johns Hopkins Applied Physics Lab news release has been viewed 809 times

  • SMTnet
  • »
  • Industry News
  • »
  • The SMTA Capital Chapter to Host First Meeting of the Year on March 4th at Johns Hopkins Applied Physics Lab
BGA Rework Services

fluid dispensing pumps for integration