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Hesse Mechatronics Appoints Representative for South America

Jan 24, 2014

Claudinei Martins, HTMG

Claudinei Martins, HTMG

HTMG to Support wire Bonding Equipment Sales in RF, Automotive and Power Electronics Markets.

Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, recently announced that it has appointed HTMG as the company’s sales representative for South America.

HTMG, led by Claudinei Martins, brings 20 years of experience with performance alloys used in high-end electronics and photonics components to Hesse Mechatronics’ business in South America.

Given their experience with wire bondable metals, HTMG is uniquely qualified to serve the growing RF, automotive and power electronics markets in South America,” said Joseph S. Bubel president of Hesse Mechatronics, Inc. “We look forward to working with Claudinei and his team in Brazil and other areas of South America.”

For more information on Hesse Mechatronics and its family of wedge bonders, please visit the company’s website at www.hesse-mechatronics.com.  For more information on Hesse Mechatronics’ training and applications support services, please e-mail info@hesse-mechatronics.us. To see wire bonding in action, visit www.wirebonddemo.com.


High Technology and Materials Group (HTMG-Brazil), is a full service industrial marketing, technical sales and logistic organization, representing global leading manufacturers of high performance materials and components, with independent business development teams at the aerospace, automotive, automation, energy, medical equipment, oil and gas, and telecom industries in South America. For more information, visit www.htmg.com.br.

Hesse Mechatronics, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon); their heavy wire wedge bonder models also handle copper wire and ribbon. The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages.

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