Assembly Technologies (Adhesives, Pb-Free Solders, Surface Mount, Others); Electrical, Thermal and Mechanical Design, Modelling and Simulation; Environmentally-friendly Electronics; Microelectronics - Diagnostics, Quality and Reliability; Microelectronics Applications in Automotive, Space and Military Electronics, Data Processing, Wireless Telecommunication, Medicine and Biotechnology; New Materials (Ceramic, Polymeric, Composites) and Film Technologies; Packaging and Interconnection (HD, Encapsulants, MEMS, Optoelectronics); Passive Components, Passive Integrated Components and Functional MCM Circuits, Sensors and Actuators, Micro Electro Mechanical Systems).
For more information, visit http://www.itme.edu.pl/imaps.cracow2002/. The deadline for abstract submission is 23 November 2001. IMAPS is a society dedicated to the advancement and growth of the use of microelectronics and electronic packaging through professional and public education, the dissemination of information and the promotion of the Society�s portfolio of technologies. Contact IMAPS at 611 2nd Street, NE, Washington, DC 20002, U.S.A., E-mail: IMAPS@imaps.org.; Tel. 202-548-4001; Fax 202-548-6115; Home Page: http://www.imaps.org.