SMT, PCB Electronics Industry News

IWLPC Best Papers Announced

Jan 21, 2014

SMTA and Chip Scale Review magazine, co-organizers of the International Wafer-Level Packaging Conference (IWLPC), announced the Best of Conference papers from the event held November 5-7, 2013 in San Jose. Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best of Conference winner.

The Best of Conference and winner of the 3D track was Jessica Fredlund, Silex Microsystems AB, for her paper, “Recent Results Using Met-Via TSV Interposer Technology as TMV Element in Wafer Level Through Mold Via Packaging of CMOS Biosensors.” Co-authors include Toby Ebefors, Silex Microsystems AB;  Erik Jung and Tanja Braun, Ph.D., Fraunhofer IZM.

Sumant Sood of SUSS MicroTec won the Best of MEMS Track for his paper, "Advanced Metal-Eutectic Bonding for High Volume MEMS WLP." Co-authors include Robert Hergert, SUSS MicroTec and Oliver Treichel, SUSS MicroTec Lithography.

William "Boyd" Rogers of DECA Technologies won the Best of Wafer-Level Packaging Track for his paper, "Implementation of a Fully Molded Fan-Out Packaging Technology." Co-authors include Chris Scanlan and Tim Olson, also from DECA Technologies.

All thirty-nine conference papers can be found on the conference proceedings available in the online SMTA BookStore.

The IWLPC Technical Committee is currently soliciting abstracts for next year’s program. Interested parties should submit 200-300 word abstracts online at http://www.iwlpc.com/call_for_papers.cfm by April 18, 2014. Note that technical papers are required and are due August 22, 2014.

IWLPC will return to the DoubleTree Hotel in San Jose, California on November 11-13, 2014.

Visit http://www.iwlpc.com/ for more information.


The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Chip Scale Review, now in its 17th year, is the leading international magazine serving the semiconductor, IC and electronic device packaging market.

Aug 16, 2017 -

SMTA Capital Expo to Feature Essemtec Fox Pick and Place System

Aug 14, 2017 -

Shannan O’Shaughnessy, GVD Corporation, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24

Aug 08, 2017 -

iNEMI’s Bill Bader to Keynote Technical Innovations Symposium at SMTA International

Aug 06, 2017 -

Gerry Partida, Summit Interconnect, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24th

Aug 01, 2017 -

Mike Bixenman, KYZEN Corporation, Wins Best of Presentation Award at the 2017 International Conference on Soldering and Reliability (ICSR)

Aug 01, 2017 -

Phil Zarrow, ITM Consulting, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24th

Jul 27, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Keynote Presenters Announced

Jul 23, 2017 -

SMTA Welcomes New Board Members

Jul 23, 2017 -

SMTA International Technical Program Expands, Includes Research from HDPUG and AREA Consortium

Jul 19, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

560 more news from Surface Mount Technology Association (SMTA) »

Aug 19, 2017 -

See Latest Dispense Technology Demonstrations From GPD Global at NEPCON 2017

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

Aug 17, 2017 -

Libra Industries Announces Two 20-Year Service Awards in Q2 2017

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 -

What is SMT and where to by SMT spare parts

Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

See electronics manufacturing industry news »

IWLPC Best Papers Announced news release has been viewed 780 times

SMT, PTH, AOI,  and Test machines for sale - ECM Equipment

PCB, BGA Rework Services