SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Engineered Materials Systems, Inc.


Engineered Material Systems Introduces 535-10M-45 UV Adhesive for Microelectronic Assembly Applications

Jan 09, 2014

Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, is pleased to debut its 535-10M-45 UV Cured Epoxy Adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications. The material contains a secondary thermal cure initiator that cures as low as 90°C for shadowed areas.

535-10M-45 is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive. The material is designed to eliminate any warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.

This new non-conductive UV cured adhesive cures rapidly when exposed to high intensity UV light. 535-10M-45 is a low outgassing, extremely flexible, high strength epoxy adhesive that does not contain antimony. It was developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications. 535-18M-57 is the latest addition to Engineered Material Systems extensive line of electronic materials.

For more information about the 535-18M-57 UV Cure Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product

You must be a registered user to talk back to us.

More News from Engineered Materials Systems, Inc.

Mar 22, 2017 -

Engineered Material Systems Introduces New UV Cured Adhesive for Bonding Lens Holders in Camera Modules

Mar 20, 2017 -

Engineered Material Systems, Inc. Develops Negative Photoresist for MEMS and IC Wafers

Mar 14, 2017 -

Engineered Material Systems to Showcase CA-150 Series Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Jan 09, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Nov 14, 2016 -

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Oct 04, 2016 -

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Smart Card Assembly Applications

Sep 13, 2016 -

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding

Sep 08, 2016 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Aug 08, 2016 -

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Dec 05, 2015 -

Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference

(44) more news from Engineered Materials Systems, Inc.

Engineered Material Systems Introduces 535-10M-45 UV Adhesive for Microelectronic Assembly Applications news release has been viewed 681 times

Precision Auger Dispense Pump

Polymeric Workmanship PCB for Training