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Engineered Material Systems Introduces Low-Cost, Snap Cure Conductive Adhesive for Die Attach Applications

Jan 07, 2014

Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, debuts its CA-175 Low Cost, Snap Cure Conductive Adhesive designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics or camera modules.

ECM CA-175 is approximately half the cost of a pure silver filled die attach adhesive, has a moderate glass transition temperature (Tg) and modulus. It has an optimized rheology for needle dispensing by time-pressure, auger or positive displacement, and is modified to provide conductivity stability during damp heat testing on tin, silver and copper surfaces. CA-175 will fully cure in eight seconds at 200°C.

CA-175 is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

For more information about the CA-175 Low Cost Electrically Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future.

For more information, visit www.emsadhesives.com.

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