SMT, PCB Electronics Industry News

Koh Young Technology Reports Growth, Increased Market Share

Dec 18, 2013

The Zenith 3D AOI system measures the true profilometric shape of components, solder joints, patterns and even foreign material on assembled PCBs with patented 3-dimensional measurement, overcoming the shortcomings and vulnerabilities of traditional 2D AOI.

The Zenith 3D AOI system measures the true profilometric shape of components, solder joints, patterns and even foreign material on assembled PCBs with patented 3-dimensional measurement, overcoming the shortcomings and vulnerabilities of traditional 2D AOI.

Koh Young Technology, a global leader in 3D measurement technology for electronics assembly, has strengthened its position in the high and mid-range segments of the 3D AOI market, and increased its sales revenue in 2013 when compared to last year's performance, it is announced today.

"Koh Young Technology is recognized globally now as the industry standard in 3D measurement and inspection technology for electronics manufacturing," stated Dr. Kwangill Koh, CEO. “We’ve doubled our revenue every year solely based on 3D SPI in the past, because we have provided customers with the true 3D values – process optimization by 3D measurement. Now we have the complete solution for optimizing the whole electronics assembly process by supplying both 3D SPI, pre reflow 3D AOI and post reflow 3D AOI systems. Going forward, we anticipate achieving and holding first-place market share status for global SMT inspection market in 2013 and beyond.”

In making the announcement, Dr. Koh pointed out that Koh Young is expected to increase its revenue YoY (Year over Year) despite the slowdown in the world economy. He pointed out that Koh Young saw 8% increased revenue for Q1-Q3 in 2013 compared to the same period for the previous year. AOI revenue alone increased by approximately 140%, an impressive achievement in sluggish economic times, he added.

The reasons for this are simple,” Dr. Koh continued. “2D technology is universally recognized as outdated. Since we had introduced the Zenith 3D AOI into the market, it has been abruptly changing the market dynamics quickly to become the industry standard, hence creating the new 3D AOI market for itself. This year, we successfully introduced our new 3D AOI Zenith LiTE for the mobile device market, which is transforming the smart devices manufacturing world. Koh Young continues to innovate and grow, providing outstanding solutions to the ever-evolving needs of our customers all around the world.”

The Zenith 3D AOI system measures the true profilometric shape of components, solder joints, patterns and even foreign material on assembled PCBs with patented 3-dimensional measurement, overcoming the shortcomings and vulnerabilities of traditional 2D AOI. Zenith uses 2D and 3D information for better visualization of the components and solder joints. This ability allows a true comparison with the IPC-A-610 standard for inspection. Thus, the acceptability of the solder joint is without question. Zenith is the first true 3D AOI system ever developed.

Zenith identifies and flags all defects, allowing no escapes, thus serving as a powerful process optimization and quality assurance tool. It also provides 3D PCB warp compensation with multi-frequency height measurement technology, which ensures uninterrupted real-time inspection of warped boards and compensation with respect to the ideal plane. It features a proven SPC package, which can forecast possible process problems, and is easily integrated into an automated line.

Dr. Koh suggested that the company’s vision for 2014 and beyond is ‘Realizing most of the Electronics Manufacturers’ Dreams - Minimizing Human Resources in the Production Line’ by providing customers with the total solution for process optimization of SMT lines. “Koh Young is ready to devote ourselves to realizing such a dream, with our customers who have the same dream. Koh Young’s solution will play the key role in enabling that dream,” Dr. Koh added.


Koh Young Technology specializes in the design and manufacturing of 3D measurement and inspection equipment for the global circuit board assembly and semiconductor markets. Direct sales and support centers are located in the United States, Europe, Japan, Singapore, China (Shenzhen) and Korea. For more information about the company, visit www.kohyoung.com

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