Rosenheim, Germany, December 2013: Multitest, announces that experts for 3D IC test will present at the European 3D TSV Summit in Grenoble, Jan 20-22, 2014.
In Session 4 “SUPPLY CHAIN READINESS FOR HVM”, on Tuesday January 21 Multitest experts will talk about “Test strategies for 2.5 & 3D”. In the following panel Multitest will discuss about “2.5D Interposer Supply Chain: Ready for HVM?” together with TSMC, STATS Chip Pac and Oerlikon Systems.
The European 3D TSV Summit will focus on the theme “Application Ready,” addressing 3D TSV from both a business and technology perspective. It will demonstrate the full range of 3D technology and R&D processes, with leading companies participating, showing a range from initial prototypes to high-volume production.
The latest TSV product developments and achievements — including cost, business models, supply chain, manufacturability and technology aspects — will be addressed by executives and experts from global companies.
To learn more about this conference visit http://www.semi.org/eu/node/8566