The SMTA is pleased to announce the Best Papers from SMTA International 2013. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.
The winner from SMTA International 2013 for the Rich Freiberger Best of Conference Award, as selected by the conference attendees, is Matt Kelly, P.Eng., IBM Corporation, for his presentation entitled "Plasma Stencil Treatments: A Statistical Evaluation."
Babak Arfaei, Ph.D. from Universal Instruments Corporation, won the Best of Proceedings category for the paper "Effect of Sn Grain Morphology on Failure Mechanisms and Reliability of Lead-Free Solder Joints in Thermal Cycling Tests."
You Chye How, Texas Instuments Malaysia Sdn. Bhd., won the Best International Paper category for the paper entitled "Reliability Improvement of Array QFN Package." This award and the Best of Proceedings are selected by the SMTA International Technical Committee.
The authors will formally be presented their awards at the Opening Ceremony during SMTA International on September 30, 2014 in Rosemont, Illinois. For information on participating in the 2014 SMTA International Conference, visit the Call for Papers page, or contact SMTA administrator JoAnn Stromberg at 952-920-7682 or email@example.com. Abstracts can be uploaded directly on-line and will be accepted through February 28, 2014.
For more information on SMTA International please contact SMTA administrator JoAnn Stromberg: firstname.lastname@example.org or 952-920-7682 or visit http://www.smta.org/smtai/.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.