SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from ESSEMTEC


Pick-and-Place Machine with Integrated Solder Paste Jet Printer

Dec 10, 2013

High productivity
Jet printing is faster (up to 80’000 dots/h) and more precise than any other dispensing system for solder pastes. So far, jetting of pastes has only been possible with specially designed, costly solder pastes. The new system from Essemtec opens the range of pastes to most type 4, 5, 6 or 7 pastes.

The combination of jet printing with pick-and-place eliminates the need to program two different machines and reduces the investment costs dramatically. Set up is done directly from CAD data using an integrated paste library. Production is fully automated and the application of solder paste and the placement of components are seamlessly integrated while process monitoring ensures high quality results.

Quick return on investment
The return on investment of the Jet Printing option is achieved approximately within 150 - 200 stencils and even fasters if the products require stepped stencils. For higher throughput, the Jet Printing option can also be installed on the multiple module Production Centre Paradoble which will also premier at productronica at Essemtec’s booth in hall A3, booth 341.

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