SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from MIRTEC Corporation


VOTE FOR MIRTEC! TOP FINALIST FOR 2014 BEST IN TEST AWARDS

Dec 05, 2013

MIRTEC, The Global Leader in Inspection Technology,” announces that it has been selected as a finalist for the 2014 Best in Test Awards in the Machine Vision/Inspection category for its MV-9 2D/3D CoaXPress In-Line AOI Series. Since 1991, the Best in Test Awards have recognized the best in test products and test professionals. Finalists first are selected by the editors of EDN Magazine and then the EDN community can vote online to determine the final winners. To submit your vote, visit www.surveymonkey.com/s/5JP5RF8.

MIRTEC’s all new MV-9 2D/3D CoaXPress In-Line AOI systems are configured with MIRTEC’s exclusive OMNI-VISION® 2D/3D Inspection Technology that combines 25 Mega Pixel 2D Inspection with advanced Digital Multi-Frequency Quad Moiré 3D inspection to provide precision inspection of SMT devices on finished PCB assemblies. The MV-9 systems may be configured with a state-of-the-art CoaXPress 25 Mega Pixel top-down camera system. This proprietary camera system is designed and manufactured by MIRTEC for use with the company’s complete product range of inspection equipment.

MIRTEC’s revolutionary CoaXPress Camera Technology is capable of providing data transfer rates of 25 Gbit/Second making the MV-9 the fastest 2D/3D AOI system in the world! MIRTEC’s revolutionary Digital Multi- Frequency Quad Moiré Technology provides true 3D inspection of SMT devices on finished PCB assemblies using a total of four (4) Moiré Inspection Probes. This proprietary system yields precise height measurement data necessary to detect lifted component and lifted lead defects as well as solder volume post reflow. MIRTEC’s technologically advanced Six Phase Lighting System uses multi-color LEDs to illuminate inspection areas from six different angles providing superior solder joint characterization and co-planarity inspection of leads on gull-wing devices. The SIDE-VIEWER® Camera System provides four 10 Megapixel angled cameras for automatic inspection of areas that are inaccessible with a Top-Down camera i.e. solder joint inspection for J-Leaded devices. The system also provides defect review from four camera angles for efficient defect analysis and classification. The MV-9 is configured with a Precision Linear Drive Positioning System providing high-speed, high-precision robot movement with rapid response, zero backlash and best of all zero maintenance.


MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry.

For further information, please visit www.mirtec.com.

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